31results about How to "Not prone to voids" patented technology

The invention discloses a die taking and die bonding device. A die bonding table moves along an X direction and a Y direction, a planar jig seat is embedded onto the die bonding table and is flush with the die bonding table, a heating device is connected with the planar jig seat, a rotation arm is provided with a welding head, the welding head is used for die taking and die bonding, a substrate is arranged above the die bonding table and does feeding motion relative to the die bonding table along the X direction, a first driving device is used for driving the rotation arm to do circumferential rotation, a wafer table is used for fixing a wafer, and a wafer table driving device is used for driving the wafer table to move along the X direction and the Y direction and driving the wafer table to rotate around a rotation shaft. The die taking and die bonding device has the beneficial effects that the planar jig seat is arranged, the substrate is heated within a certain range, the temperature is stably controlled, and a hole phenomenon is difficult to generate during chip assembly; and during die bonding, a force between the welding head and the substrate is concentrated on the planar jig seat, the requirement on integral smoothness of the die bonding table is greatly reduced, the parallelism of the welding head and the substrate arranged at a chip assembly position is improved, and the surface-mount smoothness of a semiconductor device is ensured.

The invention relates to a polyaryletherketone resin and a preparation method thereof, particularly a phthalonitrile-terminated polyaryletherketone resin and a preparation method thereof, belonging to the technical field of high-molecular materials. The invention provides a polyaryletherketone resin of which the structure is disclosed in the specification. In the structural formula of the phthalonitrile terminated polyaryletherketone resin, m+n=1, 0<m<1, and 0<n<1. The invention also provides a preparation method of the phthalonitrile-terminated polyaryletherketone resin. The method comprises the steps of (1) synthesis of hydroxyl-terminated polyaryletherketone and (2) synthesis of phthalonitrile-terminated polyaryletherketone. Bisphenol S is introduced to the main chain of the polyaryletherketones, and a crosslinking group bis-phthalonitrile is introduced to the chain end, thereby obtaining the crosslinking function on the premise of facilitating the processing due to the decrease of the melting point of the polyaryletherketones; and thus, the crosslinked polyaryletherketones can obtain the application temperature of a thermosetting engineering material by a thermoplastic engineering material processing technique, thereby opening up a new way for application of polyaryletherketones in the field of high temperature resistance.

The invention relates to an allyl-containing polyimide diamine monomer and a polyimide polymer and a preparation method thereof. The invention discloses an allyl-containing crosslinkable polyimide and a preparation method thereof and belongs to the technical field of polyimide preparation. The crosslinkable polyimide with allyl on a side chain is prepared by performing polymerization reaction on 3,3'-diallyl-4-4'-di(4-amino-2-trifluoromethyl phenoxy) biphenyl (DBDA) and 4,4'-(hexafluoroisoproryl) phthalic anhydride (6FDA) as main raw materials, so that a crosslinkable group can be introduced into a main chain structure of the polymer. By adjusting the proportion of a crosslinking monomer, a polyimide material controllable in crosslinking degree can be prepared, so that the allyl-containing polyimide diamine monomer has good processability and relatively good heat stability and mechanical property of a curing material, and therefore, the range of application of the material is enlarged and the application prospect is wide.

The invention provides an anti-deformation gypsum board drying device which comprises a stirring mechanism, a storing box, a pulp discharging mechanism, a vibrating mechanism, a forming mechanism, a machine table, a roller, a bracket, an upper paper winding rotary shaft, a lower paper winding rotary shaft, a speed measuring mechanism and a controller, wherein the stirring mechanism communicates with the storing box; the storing box communicates with the pulp discharging mechanism; the forming mechanism is fixed on the machine table; the roller is rotatably connected onto the machine table; thevibrating mechanism is arranged on one side of the machine table; the bracket is fixed on one side of the vibrating mechanism; the stirring mechanism and the storing box are arranged on the bracket;and the upper paper winding rotary shaft and the lower paper winding rotary shaft are rotatably connected onto the bracket. The anti-deformation gypsum board drying device can utilize the speed measuring mechanism to measure the moving speed of a gypsum board; and the controller controls the pumping speed of a metering pump to be matched with the moving speed of the gypsum board according to the speed value, so that the machined gypsum board is uniform in thickness and high in quality.

The invention relates to a fly ash non-sintered brick pressing forming process, which comprises: a, mixing fly ash, furnace slag, niter, cement and rocky sand crystal according to a basic matching ratio (%) of the fly ash to the furnace slag to the niter to the cement to the rocky sand crystal of 25-40:25-40:20-30:5-10:0.1-0.5; b, adding water and stirring, wherein the amount of the water for stirring is 20-30%; c, forming; and d, carrying out concrete curing. According to the present invention, the brick produced through the fly ash non-sintered brick pressing forming process has characteristics of heat resistance, heat insulation and fire retardation, is the novel thermal insulation and low temperature refrigeration heat insulation material and the ultra lightweight fire resistance raw material, is firm and durable, does not easily produce the hollow cracking phenomenon, further has characteristics of high strength and good durability, and further has effects of sound absorption, vibration reducing and wear resistance; and the fly ash is recycled so as to provide advantages of environmental pollution reducing, energy saving and environmental protection.

The invention relates to a fly ash aerated concrete building block production process, which comprises: a, a basic matching ratio (%) of cement to lime to fly ash to gypsum to aluminum powder of 7-10:15-20:65-75:3-7:0.07, and a water-cement ratio of 0.60; b, stirring, wherein the fly ash slurry, the lime and the cement are stirred for 4 min, the gypsum is added, and then stirring is formed for 1 min; c, fixed point casting; and d, high pressure steam curing. According to the present invention, the building block produced through the fly ash aerated concrete building block production process has characteristics of heat resistance, heat insulation and fire retardation, is the novel thermal insulation and low temperature refrigeration heat insulation material and the ultra lightweight fire resistance raw material, is firm and durable, does not easily produce the hollow cracking phenomenon, further has characteristics of high strength and good durability, and further has effects of sound absorption, vibration reducing and wear resistance; and the fly ash is recycled so as to provide advantages of environmental pollution reducing, energy saving and environmental protection.

The invention relates to a preparation method of a conical mica tube, and the preparation method specifically comprises the following steps: raw material preparation: mixing mica powder and a binder, and stirring to prepare a raw material; preliminary shaping is conducted, specifically, the raw materials are fed into a corresponding preparation mold, and extrusion shaping is conducted on the raw materials in the preparation mold through extrusion equipment; and finally forming: sealing the preparation mold, and then heating the preparation mold to a forming temperature so as to cure and form the raw materials. The product is taken out, the preparation mold is taken out and cooled to the room temperature, then the preparation mold is opened, the conical mica tube is taken out and inspected, and the effect that the machining difficulty of the conical mica tube can be reduced is achieved.

The invention discloses a vacuum pump coating with good wear resistance and a preparation method thereof, and belongs to the technical field of coating preparation. The vacuum pump coating comprises the following raw materials in parts by weight: 20-25 parts of cobalt, 10-15 parts of boron, 15-20 parts of titanium, 15-25 parts of carbon, 10-20 parts of chromium, 7-13 parts of potassium, 9-15 partsof sodium, 12-17 parts of nickel, 17-27 parts of copper, 15-23 parts of silicon, 7-12 parts of hafnium, 5-10 parts of zirconium, 4-9 parts of lanthanum, 30-50 parts of yttrium oxide, 15-25 parts of rare earth chloride, 10-15 parts of tetrahydrofuran, 30-40 parts of absolute ethyl alcohol and 20-30 parts of diluted hydrochloric acid. The prepared coating has better wear resistance and stronger durability and is more suitable for the interior of the vacuum pump, so that the service life of the vacuum pump is greatly prolonged.

The invention relates to a resin molded article for sealing an optical semiconductor, an optical semiconductor sealing material, and an optical semiconductor device. Provided are: a resin molded article for sealing an optical semiconductor, which is not susceptible to cracks and is not susceptible to voids during molding; an optical semiconductor sealing material obtained using the resin molded article for sealing an optical semiconductor; and an optical semiconductor device. The resin molded article for sealing an optical semiconductor is used in an optical semiconductor sealing material in which the thickness of the thinnest portion is 300 [mu]m or less, and which has a compression ratio of 90% or more and a proportion of particles having a particle diameter of 125 [mu]m or less in the resin molded article for sealing an optical semiconductor of 15% or less.