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Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic part

A heat-curable and light-curable technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, adhesive heating bonding methods, etc., can solve the problem of lower reliability, lower thickness precision of the adhesive layer, Problems such as high elastic modulus, to achieve the effect of not being easy to void and improving thickness accuracy

Pending Publication Date: 2016-11-09
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such an adhesive has a high modulus of elasticity after photocuring, and in a board having a wiring pattern with a height difference, the thickness accuracy of the adhesive layer is lowered, and voids are generated, resulting in poor reliability. low problem

Method used

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  • Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic part
  • Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic part
  • Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0227] (Preparation of Adhesive A)

[0228] As a photocurable compound, 2 parts by weight of tricyclodecane dimethanol diacrylate ("IRR-214K" manufactured by Daicel-Allnex Co., Ltd.), 11 parts by weight of lauryl acrylate ("L-A" manufactured by Kyoeisha Chemical Co., Ltd.) Parts by weight, 41 parts by weight of 4-hydroxybutyl acrylate glycidyl ether ("4HBAGE" manufactured by Nippon Chemicals Co., Ltd.) as a light and thermosetting compound, bisphenol A type epoxy resin (new "YD-127" manufactured by Nippon Steel Sumikin Chemical Co., Ltd.) 20 parts by weight, 20 parts by weight of an acid anhydride having a terpene skeleton ("YH306" manufactured by Mitsubishi Chemical Corporation) as a thermosetting agent, DBU as a curing accelerator - 1 part by weight of caprylic acid salt ("UCAT SA-102" manufactured by SAN-APRO Co., Ltd.), and 2-benzyl-2-dimethylamino-1-(4-morpholino) as a photopolymerization initiator 5 parts by weight of phenyl)-butanone-1 ("IRGACURE 369" manufactured by B...

Embodiment 2～16 and comparative example 1～3

[0230] (Preparation of Adhesives B to P)

[0231] Adhesives B to S were prepared in the same manner as the above-mentioned adhesive agent A except that the components shown in the following Table 1 were blended in the compounding amounts shown in the following Tables 2 and 3.

[0232] (evaluate)

[0233] (Viscosity of the adhesive at 25°C and 10rpm)

[0234] The viscosity of the adhesive at 25° C. and 10 rpm was measured using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283. The viscosity was evaluated according to the following criteria.

[0235] [Criteria for judging viscosity]

[0236] A: The viscosity exceeds 1600mPa·s

[0237] B: The viscosity exceeds 1000 mPa·s and is 1600 mPa·s or less

[0238] C: The viscosity exceeds 500 mPa·s and is 1000 mPa·s or less

[0239]D: The viscosity is 160 mPa·s or more and 500 mPa·s or less

[0240] E: The viscosity is more than 5mPa·s and less than 160mPa·s

[0241] F: Viscosity l...

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Abstract

Provided is an inkjet photo- and heat-curable adhesive capable of increasing the thickness precision of an adhesive layer in which the adhesive is cured and also capable of making it more difficult for voids to occur in the adhesive layer. This inkjet photo- and heat-curable adhesive comprises a photocurable compound, a heat-curable compound, a photopolymerization initiator and a heat-curing agent. When light of 1000 mJ / cm2 cumulative light quantity is irradiated on the adhesive so that the irradiance at 365 nm is 100 mW / cm2 and a B-staged adhesive is obtained, the elastic modulus at 25DEG C of the B-staged adhesive is 5.0*102 Pa to 8.0*104 Pa.

Description

technical field [0001] The present invention relates to an inkjet light and a thermosetting adhesive used for coating with an inkjet device. The present invention also relates to a method of manufacturing a semiconductor device using the above-mentioned adhesive, and an electronic component using the above-mentioned adhesive. Background technique [0002] Paste adhesives are mainly used as adhesives for fixing semiconductor elements to join support members such as semiconductor elements and substrates. In recent years, along with miniaturization of semiconductor elements, miniaturization and high performance of semiconductor packages, miniaturization is also required for supporting members used. In response to such a request, problems such as moisture spreading and overflowing of paste adhesives arise. In addition, it is difficult to control the thickness of the paste adhesive, and as a result, problems such as inclination of the semiconductor element and defective wire bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J4/02C09J5/06C09J11/06H01L21/52H01L25/065H01L25/07H01L25/18
CPCC09J5/06C09J11/06C09J201/00H01L21/52H01L25/065H01L25/07H01L25/18H01L2224/32145H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/0002C09J4/00C09J133/06C09J163/00C09J201/08H01L24/27H01L24/29H01L24/32H01L24/48C09J2203/326H01L2224/27312H01L2224/278H01L2224/2919H01L2224/2929H01L2224/29387H01L2224/73215H01L2224/83191H01L2224/83192H01L2224/83203H01L2224/83862H01L2224/83874H01L2224/94H01L2224/27318H01L24/83H01L2224/83856C09J2301/416H01L2924/00014H01L2924/00H01L2924/00012H01L2224/27H01L2224/83C08F220/1812C09J133/14H01L24/26H01L24/75C09J2301/312H01L2224/75155
Inventor 谷川满渡边贵志藤田悠介藤田义人上田伦久乾靖高桥良辅井上孝德
Owner SEKISUI CHEM CO LTD
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