Relay type rapid chip taking and chip assembling device and chip assembling machine employing same

Abstract

The invention discloses a relay type rapid chip taking and chip assembling device and a chip assembling machine employing the same. A first rotation arm is used for taking out a chip on a wafer and placing the chip on a transit table after rotation, a second rotation arm is used for taking out the chip on the transit table and placing the chip on a substrate after rotation, a welding head is used for taking out the chip and placing the chip and is arranged at one end of the first rotation arm and one end of the second rotation arm, the welding head moves in a reciprocating way along a direction parallel to a rotation shaft of the first rotation arm or the second rotation arm, and a driving device is used for driving the first rotation arm and / or the second rotation arm to rotate. The relay type rapid chip taking and chip assembling device has the beneficial effects that with the arrangement of the chip transit table, chip taking and chip assembling of the rotation arms can be synchronously performed; and remote chip taking and chip assembly is required, compared with a traditional chip taking and chip assembling mode employing a single rotation arm, the relay type rapid chip taking and chip assembling device has the advantages that the efficiency is improved by 50-70%, and the chip assembling accuracy is higher.

Description

technical field [0001] The invention relates to the field of film loading machines, in particular to a relay type fast film taking and loading device and a film loading machine using the same. Background technique [0002] In the packaging process of semiconductor devices such as ICs, chip loading is an extremely important link. The loading process is as follows: firstly, the dispensing mechanism (also known as the dispensing module) dispenses glue on the loading station of the substrate, and then the semiconductor chip is taken out from the wafer by the loading swing arm of the loading mechanism, and then transferred Go to the film loading station where the glue has been dispensed. Under the same loading yield (quality) condition, the loading efficiency of the loading machine is an important index to evaluate the performance of the loading machine. [0003] At present, for the packaging of semiconductor devices with larger wafer sizes and wider substrates, for example, so...

AI Technical Summary

Problems solved by technology

[0003] At present, for the packaging of semiconductor devices with larger wafer sizes and wider substrates, for example, some advanced packaging processes require chips to be taken out of a 12-inch wafer and then mounted on another 12-inch wafer or a large-size substrate. The far distance of picking and loading the chip is more than 700mm. If the traditional single arm picking and loading method is adopted, the arm is longer, the rotation stroke is larger, and the packaging takes a long time. At the same time, the packaging accuracy is poor and the scrap rate is high. Low production efficiency and high production costs;

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