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Ultra-thin water cooling plate and processing method thereof

A processing method and technology for water-cooled panels, which are applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. It is difficult to process the heat dissipation structure and other problems, so as to avoid unreliable welding, avoid dents, and reduce weight.

Pending Publication Date: 2017-10-13
王楠楠 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to solve the problem that the thickness of the existing water-cooled plate cannot be bent or the bending process is relatively difficult, and it is difficult to process it into a non-planar heat dissipation structure, and the processing technology of the existing water-cooled plate cannot realize the preparation of a thinner water-cooled plate Problem, the present invention provides an ultra-thin water-cooled plate and its processing method, the technical solution adopted is:

Method used

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  • Ultra-thin water cooling plate and processing method thereof
  • Ultra-thin water cooling plate and processing method thereof
  • Ultra-thin water cooling plate and processing method thereof

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Embodiment approach 1

[0055] combine Figure 1-4 and 6 illustrate this embodiment, an ultra-thin water-cooled plate of this embodiment, the thickness of the water-cooled plate is 0.5mm-3.5mm, the water-cooled plate is stacked by two plates and fixedly connected by diffusion welding, wherein at least A water flow channel is etched on the side wall of one plate, and the water flow channel is located between the two plates, and any one of the two plates is provided with a water inlet corresponding to the water inlet end and the water outlet end of the water flow channel and outlet.

[0056] In this embodiment, a water flow channel is etched on the side wall of one plate, and the other plate is a flat plate, such as image 3 shown; it is also possible to etch the water flow channels on the side walls of the two plates, and then fasten the sides of the two plates with the water flow channels oppositely, as shown in Figure 4 shown.

[0057] The thickness of the water-cooled plate in this embodiment c...

Embodiment approach 2

[0075] combine Figure 5Describe this embodiment, an ultra-thin water-cooled plate of this embodiment, the thickness of the water-cooled plate is 0.5mm-3.5mm, the water-cooled plate is provided with a water flow channel, and the width of the water-flow channel perpendicular to the surface of the water-cooled plate is 50%-70% of the thickness of the water-cooled plate. The water-cooled plate is composed of three plates superimposed on each other and fixedly connected by diffusion welding. The middle plate is provided with a hollow water flow channel, and any one of the plates on both sides is provided with a connection with the water flow channel. The water inlet and the water outlet corresponding to the water inlet and the water outlet. like Figure 5 shown.

[0076] The hollow water flow channel in this embodiment can be formed by wire cutting, laser cutting or plasma cutting, among which wire cutting is better, because the wire cutting method has a higher dimensional accu...

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Abstract

The invention discloses an ultra-thin water cooling plate and a processing method thereof and belongs to the field of water cooling plate processing. The thickness of the water cooling plate is 0.5-3.5 mm. According to the water cooling plate, the thickness of the water cooling plate is greatly reduced and is up to 0.5-3.5 mm, the minimum thickness is up to 0.5 mm, the thickness of the plate is reduced while the heat exchange effect and the pressure resistant capacity of the plate are also guaranteed, the bottleneck of the existing technology is broken, the blank of the existing technology is filled, and the unexpected technical effects are obtained. The water cooling plate is suitable for processing a nonplanar heat radiation structure.

Description

technical field [0001] The invention relates to an ultra-thin water-cooled plate and a processing method thereof, belonging to the field of water-cooled plate processing. Background technique [0002] The existing water-cooled plates are mainly divided into: [0003] 1) Pressed tube type: the metal water pipe is squeezed and connected with the heat exchange plate, and the thickness of the plate is about 10mm; [0004] 2) Buried pipe type: the metal water pipe is buried inside the heat exchange plate and connected by brazing, and the thickness of the plate is about 10mm; [0005] 3) The friction stir welding type is to mill the flow channel in the metal plate, and then weld the flow channel cover plate by friction stir welding, and the thickness of the plate is about 8mm; [0006] The above-mentioned type of water-cooled plate is relatively thick due to the existing process of processing water-cooled plates, and there is a space where bending cannot be realized due to too t...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20254H05K7/20272
Inventor 王楠楠吴丹李兆红
Owner 王楠楠
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