Low dielectric constant glass fiber and preparation method thereof
A low dielectric constant, glass fiber technology, applied in the field of glass fiber, can solve the problems of large fluctuation of glass fiber composition, reduced water resistance of glass fiber, strict furnace temperature requirements, etc., which is beneficial to wire drawing operation and good adhesion. , Improve the effect of large fluctuation of components
Inactive Publication Date: 2017-10-27
CHONGQING UNIV OF TECH
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Problems solved by technology
Although it can meet the requirements of use in terms of dielectric properties, the high B 2 o 3 The content of boron seriously volatilizes, and the glass fiber composition fluctuates greatly, which makes the drawing operation difficult. At the same time, the temperature of the kiln is strict, which will reduce the life of the tank kiln. Therefore, the production cost is high and it is difficult to produce on a large scale.
In addition, high B 2 o 3 The content also causes the water resistance of the glass fiber to decrease
Method used
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Embodiment 1
[0023] Embodiment 1-11 is prepared respectively according to the prescription in table 1, and preparation method is:
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Abstract
The invention discloses a low dielectric constant glass fiber and a preparation method thereof. The low dielectric constant glass fiber is prepared from the following components in parts by weight: 62-65% of SiO2, 11-13% of Al2O3, 13-15% of B2O3, 5-8% of CaO, 0.5-2% of TiO2, 0.5-2% of Li2O and 0.5-2% of La2O3, wherein the weight sum of TiO2 and La2O3 is not greater than 3%. The glass fiber which adopts the proportion has excellent processing property and dielectric property, and the fiber-forming temperature of the glass fiber is lower than 1350 DEG C; at room temperature, when frequency is 1MHz, a dielectric constant is 4.7-4.9, and dielectric loss is 7-9*10<-4>. The low dielectric constant glass fiber is suitable for serving as the enhancement material of a printed circuit board.
Description
technical field [0001] The invention relates to a glass fiber with low dielectric constant, which is used as a reinforcing material for printed circuit boards, and also relates to a preparation method of the glass fiber. Background technique [0002] In the past ten years, due to the rapid development of the electronic information industry, printed circuit boards have developed in the direction of high density, multi-layer, and super-multi-layer. It acts as a built-in passive component function in a multilayer board, etc. This requires materials with low dielectric constant and dielectric loss. This is because the smaller the dielectric constant of the material, the faster the signal propagation speed; at a certain propagation frequency, the smaller the dielectric loss of the material, the smaller the propagation loss. Printed circuit boards are usually composed of resin and fiberglass. The dielectric properties of resins conventionally used for printed circuit boards are...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C03C13/02C08K7/14
CPCC03C13/00C08K7/14
Inventor 田中青黄伟九
Owner CHONGQING UNIV OF TECH
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