Integrated package of IC and silicon controlled rectifier (SCR) chip and manufacturing method thereof

Abstract

The invention discloses an integrated package of an IC and a silicon controlled rectifier (SCR) chip and a manufacturing method thereof. The method comprises the steps of covering the upper end of a bracket with a layer of a copper clad laminate as a SCR substrate, respectively making input and output ends on two sides of the copper clad laminate, sequentially setting a rectifier circuit base island, an IC chip base island, a SCR chip base island, a high-voltage electric pin, a low-voltage electric pin and a heat sink on the bracket, packaging the rectifier circuit base island, the IC chip base island and the SCR chip base island through silver paste connection to form a PCB, and detecting the package of the packaged PCB. The beneficial effects of the invention are as follows: the PCB is formed by packaging through silver paste connection by taking the large area copper clad laminate as the SCR substrate, good electrical conductivity and heat dissipation are ensured, the packaging cost of the chip is also reduced, the production cost of a finished product is reduced, the production efficiency is improved, and meanwhile the product reliability is improved.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an integrated packaging of an IC and a thyristor chip and a manufacturing method thereof. Background technique [0002] The market demand for lantern controllers is huge, and the consumption of Christmas lights alone reaches hundreds of millions of strings every year. These products are used all over the world, but they are all made in China. The existing colorful lamp controllers package the IC circuit and the thyristor circuit on different brackets, and the purpose of driving control can be achieved through the connection and combination of the PCB board. For example, a four-way control chip needs an IC circuit package. And four thyristor packages, five brackets are required for five packages, and finally five devices need to be mounted on the PCB, which not only requires complicated processing and high packaging costs, but also has poor heat dissipation effect and high failu...

AI Technical Summary

Problems solved by technology

The existing colorful lamp controllers package the IC circuit and the thyristor circuit on different brackets, and the purpose of driving control can be achieved through the connection and combination of the PCB board. For example, a four-way control chip needs an IC circuit package. And four thyristor packages, five brackets are required for five packages, and finally five devices need to be mounted on the PCB board, which not only requires complicated processing and high packaging costs, but also has poor heat dissipation effect and high failure rate

Images