A LED epitaxial growth method for enhancing luminous radiation efficiency
A technology of radiation efficiency and epitaxial growth, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of low radiation efficiency in the quantum well light-emitting area, achieve the goal of suppressing electron leakage current, improving hole injection level, and enhancing radiation efficiency Effect
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Embodiment 1
[0054] Such as figure 1 with figure 2 As shown, the LED epitaxial growth method for enhancing luminous radiation efficiency described in this embodiment includes the following steps:
[0055] Step 101, using metal chemical vapor deposition method MOCVD, in 1000°C-1100°C H 2 Under the atmosphere, feed 100L / min-130L / min of H 2 , keep the reaction chamber pressure at 100mbar-300mbar, and process the sapphire substrate for 5min-10min.
[0056] Step 102 , growing a low-temperature buffer layer GaN, and etching the low-temperature buffer layer GaN to form an irregular island shape.
[0057] Step 103 , growing an undoped GaN layer.
[0058] Step 104 , growing a Si-doped N-type GaN layer.
[0059] Step 105, growing AlGaN: Zn thin barrier layer: keep the reaction chamber pressure at 800mbar-950mbar, keep the temperature at 750°C-900°C, and feed NH with a flow rate of 50000sccm-55000sccm (sccm is milliliter per minute) 3 , 50sccm-70sccm TMGa, 90L / min-110L / min H 2 , 1200sccm-1400...
Embodiment 2
[0069] This embodiment specifically describes the specific content of growing the LED epitaxial layer as a whole, such as image 3 with Figure 4 As shown, the LED epitaxial growth method for enhancing luminous radiation efficiency described in this embodiment includes the following steps:
[0070]Step 201, processing the sapphire substrate: into the reaction chamber of the metal-organic chemical vapor deposition system with the substrate placed, H at 1000°C-1100°C 2 Under the atmosphere, feed 100L / min-130L / min of H 2 , keep the reaction chamber pressure at 100mbar-300mbar, and process the sapphire substrate for 5min-10min.
[0071] Step 202, growing low-temperature buffer layer GaN: lower the temperature to 500°C-600°C, keep the reaction chamber pressure at 300mbar-600mbar, and feed NH with a flow rate of 10000sccm-20000sccm 3 , 50sccm-100sccm TMGa and 100L / min-130L / min H 2 , grow a low-temperature buffer layer GaN with a thickness of 20nm-40nm on a sapphire substrate.
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Embodiment 3
[0086] A conventional LED epitaxial growth method is provided below as a comparative example of the present invention.
[0087] Such as Figure 5 with Image 6 As shown, the conventional LED epitaxial growth method includes the following steps:
[0088] Step 301, processing the sapphire substrate: Into the reaction chamber of the metal-organic chemical vapor deposition system with the substrate placed, H at 1000°C-1100°C 2 Under the atmosphere, feed 100L / min-130L / min of H 2 , keep the reaction chamber pressure at 100mbar-300mbar, and process the sapphire substrate for 5min-10min.
[0089] Step 302, grow low-temperature buffer layer GaN: lower the temperature to 500°C-600°C, keep the reaction chamber pressure at 300mbar-600mbar, and feed NH with a flow rate of 10000sccm-20000sccm 3 , 50sccm-100sccm TMGa and 100L / min-130L / min H 2 , grow a low-temperature buffer layer GaN with a thickness of 20nm-40nm on a sapphire substrate.
[0090] Raise the temperature to 1000°C-1100°C,...
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