Supercharge Your Innovation With Domain-Expert AI Agents!

Method and system of fast breakdown location of multiple extensible memories based on BMC control

A multi-memory, BMC chip technology, applied in the field of multi-memory fault fast location, can solve the problem of wrong location of fault memory accurate location, complex log file content, confusion of mind, etc., to improve efficiency, save hardware space, and reduce production costs. Effect

Inactive Publication Date: 2017-11-21
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF2 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The limitation of this method is that the content of the generated log files is complicated, and the staff needs to carefully study the contents of the error log, and browse a large number of log files to find the log information of each memory one by one. Locating the exact location of the faulty memory

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system of fast breakdown location of multiple extensible memories based on BMC control

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Configure the system:

[0030] A scalable multi-memory fault quick location system based on BMC control, including: BMC chip, multi-channel selection chip, PCH south bridge and monitoring button;

[0031] The BMC chip is used to realize hardware management and fault detection; the BMC chip is connected to the multi-channel selection chip through the I2C bus; the multi-channel selection chip is connected to the LED light through the GPIO signal; one of the BMC chips A monitoring button is connected to an external pin; the PCH south bridge obtains information of all memory sticks through the DMI, and then sends the information to the BMC chip through the LPC bus. The BMC chip is AST2400A1-GP, and the AST2400A1-GP provides 9 groups of I2C buses; the BMC chip is connected to a multi-channel selection chip through each group of I2C buses. The multi-channel selection chip is PCA9555PW, and each PCA9555PW outputs 16 GPIO signals, and each GPIO is connected to an LED light; on...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and system of fast breakdown location of multiple extensible memories based on BMC control. The method comprises the steps that a BMC chip is selected as a master control chip, wherein the BMC chip is connected to a multi-channel selection chip through an I2C-bus, and the multi-channel selection chip is connected to an LED lamp through a GPIO signal; when a memory bank breaks down, breakdown information is sent to a CPU; a PCH South Bridge obtains information of all memory banks through a DMI, and then the information is sent to the BMC chip through an LPC-bus; the BMC chip collects and organizes information data of the broken-down memory bank; a monitor button is connected to an outer pin of the BMC chip, when the monitor button is pressed, an instruction of checking the broken-down memory bank is sent to the BMC chip, and then the BMC chip controls and turns on the LED lamp. According to the method and system of the fast breakdown location of the multiple extensible memories based on the BMC control, the efficiency of broken-down memory location is greatly improved, not only is hardware space saved, but also the labor cost is saved to some extent, the efficiency is improved, and thus the production cost is reduced to some extent.

Description

technical field [0001] The invention relates to the technical field of computer data storage, in particular to a method and system for rapidly locating multi-memory faults based on BMC control. Background technique [0002] With the continuous development of information technology, the application of servers is more extensive, and higher requirements are put forward for the performance configuration of servers. The number of memory cards that can be supported by a single board of a server has reached dozens. Quickly locate the fault location of the detected memory card slot, so as to replace or maintain the memory module. [0003] Traditional memory fault detection mainly relies on two methods: one is to rely on memory pressure testing. After the preliminary judgment is that it is a memory fault, it is necessary to locate which memory has a fault from more than a dozen memories, and use memory pressure testing tools to test the system platform. Batch testing with the memory...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F11/07G06F11/32
CPCG06F11/0751G06F11/327
Inventor 宋丽青奚立达
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More