Femtosecond laser processing system and method
A femtosecond laser processing and femtosecond laser technology, applied in the field of femtosecond laser processing systems, can solve problems such as poor results, and achieve the effect of increasing activity and improving processing efficiency
Active Publication Date: 2019-02-01
CENT SOUTH UNIV
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Problems solved by technology
[0003] Although researchers try to improve the efficiency of femtosecond laser processing by optimizing laser parameters such as wavelength, repetition rate, pulse width and other processing parameters, the effect is still not good
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[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are the Some, but not all, embodiments are invented. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0030] figure 1 A schematic diagram of a femtosecond laser processing system provided by an embodiment of the present invention, such as figure 1 As shown, the system includes: a femtosecond laser emitting device 1, a first optical path 2 and a second optical path 3; wherein,
[0031] The femtosecond laser emitting device 1 includes at least one femtosecond laser for ...
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The invention provides a femtosecond laser machining system and method. The method includes the steps of opening a first light gate, closing a second light gate, adjusting the laser flux of a first femtosecond laser beam to be lower than a modification threshold of a to-be-machined workpiece through a first light path, transmitting the adjusted first femtosecond laser beam to a to-be-machine area of the to-be-machined workpiece, radiating the to-be-machined area of the to-be-machined workpiece, opening the second light gate, focusing a second femtosecond laser beam to the to-be-machine area of the to-be-machined workpiece through a second light path, and machining the to-be-machine area of the to-be-machined workpiece. On one hand, before the to-be-machined workpiece is machined, the first femtosecond laser beam radiates the to-be-machined area of the to-be-machined workpiece; on the other hand, when the to-be-machined workpiece is machined, the first femtosecond laser beam assists in machining the to-be-machined area of the to-be-machined workpiece, and the machining efficiency can be greatly improved.
Description
technical field [0001] Embodiments of the present invention relate to the technical field of laser processing, and more specifically, to a femtosecond laser processing system and method. Background technique [0002] Femtosecond lasers are widely used in the production of micro-optical components and microelectronic devices due to their ultra-short pulse delay and extremely high peak power. For different use requirements, devices need to have different properties. In microbiological testing, we need the substrate to be transparent and can be observed at all times. It needs to be made of materials like glass. If it is used in the casing of an aircraft engine, then This kind of material needs to be hard enough. At this time, it is necessary to choose a suitable metal or metal alloy. Many scholars have conducted research on the processing of these materials using femtosecond lasers. Recently, studies have found that the experimental environment, such as humidity, temperature, ...
Claims
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IPC IPC(8): B23K26/067B23K26/0622B23K26/064B23K26/03
CPCB23K26/03B23K26/0624B23K26/0648B23K26/0673
Inventor 孙小燕褚东凯胡友旺段吉安银恺
Owner CENT SOUTH UNIV