ic lead frame chip electroplating silver plating machine

Abstract

The invention relates to the technical field of automation equipment, in particular to an IC leading wire frame chip-type electroplating silver-plating machine. The IC leading wire frame chip-type electroplating silver-plating machine comprises a bottom platform D, a chemical discharging cylinder is arranged on the middle surface of the platform D, a water discharging opening is formed in the bottom of the medical discharging cylinder, and a template slot container is arranged in the medical discharging cylinder; a jet plating structure is arranged in the template slot container, and the jet plating structure comprises a plating head; conveying structures are arranged at the front part and the rear part of the medical discharging cylinder, and a bracket D is arranged on the bottom platform D; a sliding platform C is arranged on the bracket D, and a movable mechanical arm A and a movable mechanical arm B are connected to the lower part of the sliding platform C; the mechanical arm B comprises a template pressure head capable of lifting up and down, the template pressure head and the template slot container are connected with a rectifier, the plating head is connected with a water feeding pump; and a motor, the mechanical arm A, the mechanical arm B, the rectifier, the water feeding pump are connected with a controlling system. The IC leading wire frame chip-type electroplating silver-plating machine has the beneficial effects that the silver plating precision is high, and the silver plating effect is good; the area of the template slot container is increased, and the products with wide width can be processed; and the volume of the medical discharging cylinder is enlarged, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to the field of chip electroplating equipment for IC lead frames, in particular to an IC lead frame chip electroplating silver plating machine. Background technique [0002] The sliding table in the traditional IC lead frame sheet silver plating process is generally driven by the cylinder, which leads to the unstable operation of the sliding table, the precision is not high enough, and the adjustment is very troublesome, and the production efficiency is low; the traditional limit baffle It is directly fixed on the bottom platform. It is very inconvenient and time-consuming to adjust the position. The adjustment accuracy is not satisfactory; the width of the template groove is relatively small, and only products with a relatively small width can be processed. Products with an increased width It cannot be processed; the design of the chemical discharge cylinder is relativ...

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Problems solved by technology

[0003] In order to solve the technical problem of low production efficiency of the above-mentioned prior art electroplating machine, the invention provides an IC lead frame chip electroplating silver plating machine

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