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Initial pitch occupation for laser processing

A technology of laser processing and laser processing head, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., and can solve time-consuming and other problems

Active Publication Date: 2019-10-18
TRUMPF LASERSYST FOR SEMICON MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such discontinuous positioning of the processing head can be time consuming

Method used

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  • Initial pitch occupation for laser processing
  • Initial pitch occupation for laser processing
  • Initial pitch occupation for laser processing

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Experimental program
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Embodiment Construction

[0026] The aspects described here are based in part on the recognition that integrating the process of occupying the pitch into the motion process that occurs prior to the separation cut can save useful time. It is also known that a suitable selection of the position to be traversed also allows a precise movement to the starting position despite possible fluctuations in the workpiece size within the tolerance range of the workpiece.

[0027] Combine below figure 1 An exemplary machine tool based on a laser processing system is described, in which the approach disclosed here for moving to contour cutting can be used. hereafter refer to figure 2 and 3 schematic diagram of and Figure 4 A flowchart illustrating the movement of the processing head.

[0028] exist figure 1 In , a machine tool 1 with a laser processing device 3 is shown as the basic machine for processing a workpiece 5 . The machine tool 1 is operated via an operating console 7 of a control system (not explic...

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Abstract

A method for moving a laser processing head (11) to a starting position (27) for laser processing, the starting position being set at a working distance from a surface (5A) of a workpiece (5), laser processing The head has a distance sensor, wherein the laser processing head (11) is to cause a contour cutting of the workpiece (5) starting at a workpiece edge (33) of the workpiece (5). Starting from the starting position (27) and the predetermined entry area (25), the laser processing head (11) is moved in the direction of the starting position (27) through the entry area (25), which is the same as the starting position ( 27) is the distance that enables the above-mentioned spacing of the laser processing head (11) to be adapted to the working distance when moving the laser processing head (11) from the entry area (25) to the starting position (27) , wherein the distance adjustment based on the distance sensor mechanism is activated after the laser processing head (11) enters the entry area (25). During the adjustment of the distance between the laser processing head (11) and the workpiece (5) to the working distance through the distance adjustment, the laser processing head (11) is moved from the entry area (25) to the starting position (27), so that the laser processing head (11) The starting position (27) is passed by the working distance. The laser processing head (11) is then moved towards the workpiece edge (33) and beyond the workpiece edge (33), wherein, for example, deactivation and deactivation of the distance adjustment based on the distance sensor mechanism are carried out at the starting position (27) Activation of pitch freeze. The laser machining head (11) is then moved towards the workpiece edge (33) and moved back above the workpiece (5) in the direction of the starting position (27), wherein the laser beam from the laser beam is switched on before passing the workpiece edge (33). Laser emission of the processing head (11). Thus, the laser processing head (11) passes the starting position (27) at a working distance while emitting the laser light, wherein, for example, when the starting position (27) is passed, the reactivation and the distance adjustment based on the distance sensor mechanism are carried out Deactivation of spacing freeze.

Description

technical field [0001] The invention relates to a method for taking up an initial distance, for example during laser cutting, and in particular a method for moving a machining head to the starting point of a separating cut, such as a trimming cut. Furthermore, the invention relates to a laser processing device for carrying out such a method. Background technique [0002] An effective initial spacing can be used in particular with thermoformed workpieces which have one or more natural edge sections. Natural edges are in particular edges that do not require further processing due to a more precise dimensional accuracy in the forming process or deep drawing process or for structural reasons. Correspondingly, in thermoformed workpieces it is possible to dispense with peripheral trimming cuts, and instead only edge sections of the contour are machined with space-limited trimming cuts. Since the starting point for such contour cutting is on the workpiece edge, or the laser switc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/03B23K26/04B23K26/08B23K26/21B23K26/38B23K37/02B23K37/04
CPCB23K26/0342B23K26/21B23K26/048B23K26/0853B23K26/0884B23K26/38B23K37/0235B23K37/04B23K37/0461B23K26/361
Inventor T·哈根洛赫
Owner TRUMPF LASERSYST FOR SEMICON MFG