Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

FR4 plate reinforcement method for flexible circuit board

A flexible circuit board, FR4 technology, applied in the direction of bendable/stretchable components, printed circuits, printed circuits, etc., can solve problems such as hidden quality problems, improve quality, reduce scrap rate, and avoid hidden quality problems Effect

Inactive Publication Date: 2017-12-12
SUIWA HIGH TECH ELECTRONICS INDS XIAMEN
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to provide a method for reinforcing FR4 boards of flexible circuit boards, so as to solve the hidden quality problems caused by particles, burrs or debris in the existing methods of reinforcing FR4 boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • FR4 plate reinforcement method for flexible circuit board
  • FR4 plate reinforcement method for flexible circuit board
  • FR4 plate reinforcement method for flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention.

[0019] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0020] Such as figure 1 As shown, a method for reinforcing an FR4 board of a flexible circuit board may include the following steps:

[0021] S1. The FR4 plate is cut into the FR4 reinforcement plate of the desired shape by machining, for example, machining operations such as punching and edge milling can be performed through a mold or a milling...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an FR4 plate reinforcement method for a flexible circuit board. The FR4 plate reinforcement method comprises the following steps: S1, cutting an FR4 plate into an FR4 reinforcing plate in a required shape through machining; S2, placing the FR4 reinforcing plate obtained in the step S1 into a rolling casting machine loaded with grinding particles and clear water, and performing rolling casting and cleaning for a preset period of time; S3, drying the FR4 reinforcing plate processed in the step S2; S4, performing gum application on an area to be reinforced of the flexible circuit board; S5, laminating the FR4 reinforcing plate obtained in the step S3 onto the area to be reinforced of the flexible circuit board processed in the step S4; and S6, performing press-fitting baking on the laminated FR4 reinforcing plate. According to the FR4 plate reinforcement method, the FR4 reinforcing plate is free from particle residues, burrs and chippings, the FPC quality is improved, the rejection rate in the production process is reduced, and downstream customers are prevented from probable potential quality hazards.

Description

technical field [0001] The invention relates to the field of production and manufacture of flexible circuit boards, in particular to a method for reinforcing FR4 boards of flexible circuit boards. Background technique [0002] The main material of the flexible circuit board is generally polyimide film (PI), and the board is coated with epoxy resin or acrylic adhesive on the PI to make a copper-clad laminate, referred to as a soft board or FPC. High linear density, light weight, thin thickness, small size, bending resistance and so on. The application range of FPC is getting wider and wider, and it is widely used in the fields of computer and communication, consumer electronics, automobile, military and aerospace, medical treatment, etc., such as cameras, mobile phones, CD players, notebook computers, medical equipment, etc. The demand for printed circuit design has prompted a large number of flexible circuit boards. FPC has the characteristics of bending and bending, so in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/0064H05K1/0281H05K2201/2009
Inventor 周晓亮罗卫勇李冬波
Owner SUIWA HIGH TECH ELECTRONICS INDS XIAMEN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com