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Imaging element, multilayer imaging element and imaging device

An image sensor and carrier blocking layer technology, which is applied in radiation control devices, electric solid state devices, semiconductor devices, etc., can solve the problems of reduced photoelectric conversion efficiency, no mention of image sensors, and no spectral characteristics involved. Dark current, good external quantum efficiency and spectroscopic characteristics, effect of improving dark current-voltage characteristics

Active Publication Date: 2018-01-02
SONY GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the organic photoelectric conversion layer 23 is a layer that performs a photoelectric conversion function, so it is generally difficult to achieve a thickness that can be increased while avoiding a decrease in photoelectric conversion efficiency that occurs when light of a specific wavelength is photoelectrically converted.
In addition, if the material used to form the organic photoelectric conversion layer 23 in the multilayer imaging device has spectral characteristics that also absorb light of wavelengths other than the desired wavelength, increasing the thickness of the organic photoelectric conversion layer 23 will cause the following problems: Potential problem: Blocking light that should be absorbed by the photoelectric conversion layer used to form the underlying image sensor
However, in this International Patent Application Publication, there is no mention of image sensors, no reference to spectral characteristics, and no mention of capacitance

Method used

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  • Imaging element, multilayer imaging element and imaging device
  • Imaging element, multilayer imaging element and imaging device
  • Imaging element, multilayer imaging element and imaging device

Examples

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Embodiment 2

[0048] 3. Embodiment 2 (variation of Embodiment 1)

[0049] 4. Embodiment 3 (variations of Embodiment 1 and Embodiment 2, the stacked image sensor of the present invention, and the camera module according to the second aspect of the present invention)

[0050] 5. Other

[0051] Outline of the image sensor according to the first aspect to the third aspect of the present invention, the stacked imaging device according to the present invention, and the imaging module according to the first aspect to the second aspect of the present invention

[0052] A configuration in which three types of image sensors are stacked in the vertical direction can be mentioned. Specifically, the three image sensors include an image sensor according to one of the first to third aspects of the present invention (for convenience, it will be referred to as a "blue image sensor"), and an image sensor according to the first aspect of the present invention. ~ Another image sensor of one of the third aspe...

Embodiment 1

[0076] Embodiment 1 relates to the image sensor according to the first aspect to the third aspect of the present invention, and also relates to the camera module according to the first aspect of the present invention.

[0077] Such as figure 1 A and figure 1 As shown in the conceptual diagram of B, each image sensor 11 of Embodiment 1 includes at least a first electrode 21 , a second electrode 25 , an organic photoelectric conversion layer 23 and a carrier blocking layer 22 . Specifically, the first electrode 21 serves as an anode, the second electrode 25 serves as a cathode, and the carrier blocking layer 22 is disposed between the first electrode 21 and the organic photoelectric conversion layer 23 . More specifically, each image sensor 11 of Embodiment 1 consists of at least a first electrode (anode) 21, a carrier blocking layer (first carrier blocking layer) 22, an organic photoelectric conversion layer 23, and a second Two electrodes (cathode) 25 are formed. In additio...

Embodiment 3

[0159] Embodiment 3 is a modified example of the image sensor of Embodiments 1 and 2, and relates to the stack-type imaging device of the present invention and the imaging module according to the second aspect of the present invention. Specifically, the stacked image pickup device (longitudinal spectroscopic image pickup device) of Embodiment 3 is formed of at least two image sensors identical to one of those described in Embodiments 1 and 2, and the at least two Image sensors are stacked on top of each other. On the other hand, the camera module of Example 3 includes a plurality of such laminated camera devices. Specifically, such as Figure 7 As shown in the conceptual diagram of A, the laminated imaging device of Embodiment 3 has the following configuration: three image sensors (three sub-image sensors) composed of the blue image sensor, green image sensor, and red image sensor described in Embodiments 1 and pixels) are stacked vertically. Therefore, it is possible to ob...

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Abstract

An imaging element is provided with at least a first electrode, a second electrode, an organic photoelectric conversion layer and a carrier blocking layer. The carrier blocking layer is formed of a material having structural formula (1), and has a thickness of from 5*10-9 m to 1.5*10-7 m.

Description

technical field [0001] The present invention relates to an image sensor, a laminated camera device, and a camera module. Background technique [0002] In recent years, in order to satisfy various applications, image sensors have been improved in performance and diversified in functions, and are still evolving. As one of next-generation technologies, photoelectric conversion not by inorganic semiconductor materials but by organic semiconductor materials can be mentioned. These image sensors are called "organic image sensors". In addition, an image sensor (called a "stacked image pickup device") having spectral sensitivity corresponding to red, green, and blue due to stacking a plurality of organic semiconductor layers is being developed, and such an image sensor is causing people's attention. These stacked imaging devices do not require a color separation optical system, and can extract three electrical signals (image signals) corresponding to red, green, and blue from a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146C07D495/04H01L51/00H01L51/30H01L51/42
CPCC07D495/04H01L27/146Y02E10/549H10K85/6576H10K30/353H10K39/32H10K30/86H01B1/12H10K30/00H10K85/311H10K85/626H10K85/6572H10K99/00H10K30/82H10K2102/00
Inventor 氏家康晴村田昌树熊谷裕也茂木英昭平田晋太郎
Owner SONY GRP CORP
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