This invention relates to an
interface layer for optoelectronic devices, its fabrication method, and its application, belonging to the field of optoelectronic device technology. The hole
interface layer prepared by this invention is based on a
perovskite precursor, and the material is homologous to
perovskite, resulting in better interfacial compatibility between the hole
interface layer and the
perovskite layer. This facilitates perovskite layer growth, reduces the interfacial defect density between the perovskite and hole interface
layers, effectively suppresses
detector dark current, and achieves high detectivity and device stability. The perovskite precursor of the hole interface layer specifically incorporates Sn. 2+ This invention can oxidize and form an
oxide protective layer during heat treatment, suppressing the hole interface layer from being damaged by subsequent steps. Compared to the PEDOT:PSS
transport layer, the hole interface layer of this invention can reduce the
dark current of perovskite optoelectronic devices by an
order of magnitude and achieve better device stability. This invention allows for flexible adjustment of the electrical parameters of the hole interface layer, enabling targeted optimization for specific applications.