Graphene enhancement type InGaAs infrared detector

An infrared detector and graphene technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as difficulty in further improving mobility, affecting efficient absorption and conversion, and difficulty in growing InP single crystals, so as to improve photoelectric conversion efficiency , the effect of low defect density and high relaxivity

Inactive Publication Date: 2013-11-06
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, InP single crystal growth is difficult and fragile, and the mobility is difficult to further improve, and its device performance is close to the limit level
In addition, due to the introduction of the InP capping layer, the incident light will be reflected multiple times between multiple interfaces, which will weaken the light entering the absorbing layer, thus seriously affecting the efficient absorption and conversion of the optical signal by the InGaAs infrared detector.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Graphene enhancement type InGaAs infrared detector

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0024] The structure of a graphene-enhanced InGaAs infrared detector with a cut-off wavelength of 2.6 μm is: sequentially grown on an n-type GaAs substrate with a thickness of about 1 μm and a Si doping concentration of 2×10 18 cm -3 n-type InAs 0.60 P 0.40 The buffer layer continues to grow to a thickness of 2.5 μm and a Si doping concentration of 8×10 16 cm -3 (lowly doped) n-type In 0.82 Ga 0.18 As absorption layer, and finally a single-layer p-type graphene cap layer is grown to form a pin detector structure.

[0025] In this embodiment mode, the S-doped n-type GaAs is used as the substrate, and the Si-doped InAs is grown on the GaAs substrate by a two-step MOCVD system. 0.60 P 0.40 Buffer layer, first grow a layer of InAs of about 100nm at a temperature of 450℃ 0.60 P 0.40 , and then raise the temperature to 580 °C, during which the buffer layer InAs 0.60 P 0.40 Annealing and recrystallization releases the stress caused by the lattice mismatch and becomes the i...

specific Embodiment approach 2

[0026] The structure of a graphene-enhanced InGaAs infrared detector with a cut-off wavelength of 2.6 μm is: sequentially grown on an n-type InP substrate with a thickness of about 2 μm and a Si doping concentration of 2×10 18 cm -3 n-type In 0.82 Al 0.18 As buffer layer, continue to grow to a thickness of 3.5 μm and a Si doping concentration of 8×10 16 cm -3 (lowly doped) n-type In 0.82 Ga 0.18 As absorption layer, and finally a multilayer p-type graphene capping layer is grown to form a pin detector structure.

[0027]In this embodiment mode, the S-doped n-type InP is used as the substrate, and the Si-doped In is grown on the InP substrate by a MOCVD system using a two-step method. 0.82 Al 0.18 As buffer layer, first grow a layer of In about 200nm at a temperature of 450°C 0.82 Al 0.18 As, and then the temperature was raised to 580 °C, during which the buffer layer In 0.82 Al 0.18 As annealing and recrystallization releases the stress caused by the lattice mismatc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a graphene enhancement type InGaAs infrared detector. The graphene enhancement type InGaAs infrared detector solves the technical problem that an existing infrared detector is narrow in detection range and high in dark current. According to the graphene enhancement type InGaAs infrared detector, a buffer layer, an InGaAs absorbing layer with wavelength extended and a graphene cover layer which grow sequentially on a substrate form a pin detector structure. The invention discloses a method for growing the mismatch buffer layer on the substrate in a two-step method. An InAlAs ternary system material or InAsP of an InGaAs material which is suitable for metallorganic chemical vapor deposition technology growth and convenient to control and enables forbidden bandwidth to be larger than extended wavelength is adopted and can effectively avoid mismatch dislocation and be suitable for a transparent buffer layer structure with light entering at the back. The method for utilizing graphene to serve as the cover layer of the InGaAs infrared detector to expand the detection range and reduce dark current is provided, detector performance is improved, and the graphene enhancement type InGaAs infrared detector has wide application prospect.

Description

technical field [0001] The invention relates to the application field of optoelectronic materials and devices, in particular to a wide-band graphene-enhanced InGaAs infrared detector using a graphene film as a cover layer. Background technique [0002] InGaAs detector is one of the most important short-wave infrared detectors at present. The narrow detection range and high dark current are the main problems restricting its development and application. In recent years, the structure design of broadband InGaAs materials has become the latest hot research direction in the field of international semiconductor photodetection research. The study found that since InGaAs material is a direct bandgap material with full composition, the application range of the detector can be effectively expanded by increasing the In composition. However, increasing the In composition will inevitably lead to lattice mismatch between the InGaAs material and the substrate, and when the mismatch is lar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/105H01L31/0352H01L31/0328
Inventor 张志伟缪国庆宋航蒋红黎大兵孙晓娟陈一仁李志明
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap