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Wavelength division multiplexing equipment

A technology of wavelength division multiplexing and equipment, which is applied in the field of optical communication equipment, can solve the problems of large noise and low heat dissipation efficiency, and achieve the effect of solving large noise, high heat dissipation efficiency, and low heat dissipation efficiency

Inactive Publication Date: 2018-01-09
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a wavelength division multiplexing device, which solves the problems of low heat dissipation efficiency and large noise in the prior art that the wavelength division device adopts air-cooled heat dissipation technology

Method used

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  • Wavelength division multiplexing equipment
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  • Wavelength division multiplexing equipment

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Embodiment 1

[0031] Such as figure 1 As shown, the embodiment of the present invention provides a wavelength division multiplexing device, including: a wavelength division board and a heat dissipation device 10 for dissipating heat from the wavelength division board. Wherein, the WDM board includes: a board body, and functional devices arranged on the board body; wherein, the board body includes a bottom board and a PCB board arranged on the bottom board, and the functional devices are fixed on the PCB board. The heat dissipation device includes: a refrigerant channel 101 for circulating refrigerant liquid and a groove 102 for accommodating functional devices. Wherein, the groove 102 is arranged on the outer surface of the heat sink 10 facing the WDM veneer at a position corresponding to the functional device, and a gap coated with a heat-conducting material is provided between the groove 102 and the functional device; the refrigerant channel 101 is used for heat dissipation The interior ...

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Abstract

The invention discloses wavelength division multiplexing equipment comprising a wavelength division single board and a heat sink used for diffusing the wavelength division single board heat; the wavelength division single board comprises a single board body and a function device arranged on the single board body; the heat sink comprises a refrigerant channel used for circulating a refrigerant liquid and a groove used for containing the function device; the groove is arranged in a position, corresponding to the function device, on the outer surface of the heat sink, wherein the outer surface isfacing to the wavelength division single board; a gap coated by a heat conduction material is arranged between the groove and the function device; the refrigerant channel paves and extends in the heat sink, and is not connected with the groove. The wavelength division single board is covered by the heat sink, so the liquid cooling heat radiation using a conduction convection mode can replace an air-cooled heat radiation mode, thus greatly improving the heat radiation efficiency, and solving the problems that the air-cooled heat radiation mode is poor in heat radiation effect and large in noises.

Description

technical field [0001] The invention relates to the field of optical communication equipment, in particular to a wavelength division multiplexing equipment. Background technique [0002] At present, WDM equipment adopts air-cooled heat dissipation technology, but with the increasing speed of equipment and the increasing demand for hardware integration, the air-cooled heat dissipation capacity is approaching the bottleneck, people are on duty, and the noise requirements in commercial environments are more stringent, energy-saving and environmentally friendly. The concept is gradually becoming popular, which makes us urgently need to improve the cooling technology of high-power consumption equipment. Contents of the invention [0003] The invention provides a wavelength division multiplexing device, which solves the problems of low heat dissipation efficiency and large noise in the prior art that the wave division device adopts air-cooled heat dissipation technology. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20
Inventor 尤晓彬
Owner ZTE CORP