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Laser welding method for medium plate and frame of mobile phone

A laser welding and frame technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of uneven solder joint size and poor welding strength, and achieve uniform solder joint size, high welding strength and deep penetration Consistent effect

Inactive Publication Date: 2018-01-19
HANS LASER TECH IND GRP CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a laser welding method for the middle plate and frame of the mobile phone, so as to solve the defects of uneven solder joint size and poor welding strength in the prior art when the middle plate and frame of the mobile phone are formed.

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  • Laser welding method for medium plate and frame of mobile phone
  • Laser welding method for medium plate and frame of mobile phone
  • Laser welding method for medium plate and frame of mobile phone

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Embodiment Construction

[0027] The present invention provides a laser welding method for the middle panel and frame of a mobile phone. In order to make the purpose, technical solution and effect of the present invention clearer and more definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] The invention provides a laser welding method for the middle plate and the frame of the mobile phone, such as figure 1 shown, including the following steps:

[0029] Step A, draw a circular track on the welding surface of the middle plate and frame of the mobile phone to form a processing area;

[0030] Step B. Using a nanosecond laser to weld and fill straight lines at equal intervals in the processing area to form an inverted trapezoidal weld.

[0031] Draw a circle on the we...

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Abstract

The invention relates to the technical field of laser welding, and particularly to a laser welding method for the medium plate and frame of a mobile phone. The laser welding method comprises the following steps: step A, drawing a circular trace on the to-be-welded surfaces of the mobile phone medium plate and frame in advance, so as to form a processing area; and step B, adopting a nanosecond laser device for filling the processing area with equally spaced straight lines by welding, so as to form an inverted trapezoidal welding seam. According to the laser welding method for the medium plate and frame of the mobile phone, the circular trace is drawn on the to-be-welded surfaces of the mobile phone medium plate and frame, and the nanosecond laser device is adopted for welding, so that the welding of the mobile phone medium plate and frame made from dissimilar metals and hard-to-welding materials is effectively realized, the welding seam formed on the to-be-welded surfaces is inverted trapezoidal, the welding spots are uniform in sizes, the fusion penetration consistency is high, and the welding strength is high.

Description

technical field [0001] The invention relates to the technical field of laser welding, in particular to a laser welding method for a middle plate and a frame of a mobile phone. Background technique [0002] Usually, a mobile phone is generally composed of components such as a screen, a main board, a mobile phone middle board, and a battery. The structure and material of the middle board of a mobile phone determine the strength of the mobile phone. Liquid metal, also known as metallic glass or amorphous alloy. The raw materials of liquid metal are various metal elements, which are combined in a certain proportion to reduce the crystallization tendency. When the cooling rate is very high, an amorphous state will appear, that is, liquid metal. The strength of liquid metal is more than 10 times that of aluminum-magnesium alloys, more than 2 times that of stainless steel and titanium alloys; the hardness is also more than 10 times that of magnesium-aluminum alloys, more than 1.5 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/24B23K26/60
Inventor 钱德宇刘昊冯伟贤胡勇徐作斌高云峰
Owner HANS LASER TECH IND GRP CO LTD
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