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Porous copper body, porous copper composite member, method for producing porous copper body, and method for producing porous copper composite member

A manufacturing method, a technology for composite parts, applied in the direction of chemical instruments and methods, tubular elements, lighting and heating equipment, etc., which can solve the problems of no mention of crystal particle size, undisclosed, reduced heat transfer and electrical conductivity, etc., To achieve the effect of excellent heat transfer and electrical conductivity

Active Publication Date: 2018-01-19
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, in the region of the redox layer, there are many grain boundaries, which may lead to a decrease in heat transfer and electrical conductivity.
In addition, in the skeleton part of the three-dimensional network structure, there is no mention of the crystal grain size at all, and when the crystal grain size is small, the heat transfer and electrical conductivity will be reduced.
[0011] Moreover, in Patent Document 1, the case of using a porous metal body containing stainless steel is described as an example, but it has not been disclosed under what conditions the oxidation treatment and reduction treatment are performed in a porous metal body containing copper or a copper alloy. to modify the surface

Method used

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  • Porous copper body, porous copper composite member, method for producing porous copper body, and method for producing porous copper composite member
  • Porous copper body, porous copper composite member, method for producing porous copper body, and method for producing porous copper composite member
  • Porous copper body, porous copper composite member, method for producing porous copper body, and method for producing porous copper composite member

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no. 1 approach

[0051] First, refer to Figure 1 to Figure 4 , the porous copper body 10 according to the first embodiment of the present invention will be described.

[0052] Such as figure 1 As shown, the porous copper body 10 of the present embodiment has a skeleton portion 12 in which a plurality of copper fibers 11 are sintered.

[0053] Here, the copper fiber 11 is made of copper or a copper alloy, has a diameter R in the range of 0.02 mm to 1.0 mm, and a ratio L / R of the length L to the diameter R in the range of 4 to 2500. In the present embodiment, the copper fiber 11 is made of, for example, C1100 (tough copper).

[0054] In addition, in the present embodiment, shapes such as twisting and bending are given to the copper fibers 11 .

[0055] In addition, in the copper porous body 10 of the present embodiment, the apparent density ratio D A is the true density D of the copper fiber 11 T 51% of the following. Regarding the shape of the copper fiber 11, the apparent density ratio ...

no. 2 approach

[0108] Next, a copper porous composite member 100 according to a second embodiment of the present invention will be described with reference to the drawings.

[0109] Figure 5 The copper porous composite member 100 of this embodiment is shown. The copper porous composite member 100 includes a copper plate 120 (part body) made of copper or a copper alloy, and a copper porous body 110 bonded to the surface of the copper plate 120 .

[0110] Here, similarly to the first embodiment, the copper porous body 110 of the present embodiment is sintered with a plurality of copper fibers to form a skeleton part. Here, the copper fiber is made of copper or a copper alloy, has a diameter R in the range of 0.02 mm to 1.0 mm, and a ratio L / R of the length L to the diameter R in the range of 4 to 2500. In the present embodiment, the copper fiber is made of, for example, C1100 (tough copper).

[0111] In addition, in this embodiment, shape provision, such as twist and bend, is given to copp...

Embodiment

[0148] Hereinafter, the results of confirmation experiments conducted to confirm the effects of the invention of the present application will be described.

[0149] Using the raw materials shown in Table 1, a copper porous body having a skeleton portion of a three-dimensional network structure was produced. In addition, in Example 11 of the present invention, a porous material made of nonwoven fabric was used.

[0150] In addition, in Example 8 of the present invention, homogenization treatment was performed at 900° C. for 24 hours in a nitrogen atmosphere before the oxidation-reduction treatment step.

[0151] Furthermore, oxidation-reduction treatment and recrystallization treatment were performed under the conditions shown in Table 2, and a copper porous body having a width of 30 mm×length of 200 mm×a thickness of 5 mm was produced. In addition, in the comparative example, the recrystallization treatment was omitted.

[0152]Furthermore, the diameter of the skeleton part ...

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Abstract

A porous copper body (10, 110) is provided with a skeleton (12) having a three-dimensional network structure, and is characterized in that: an oxidation-reduction layer formed by oxidation-reduction processing is provided to the surface of the skeleton (12); and the average crystal grain size of the whole body including the skeleton (12) and the oxidation-reduction layer is set so as to be at least 5% of the diameter of the skeleton.

Description

technical field [0001] The present invention relates to a copper porous body made of copper or a copper alloy, a copper porous composite part in which the copper porous body is bonded to a part main body, a method for manufacturing the copper porous body, and a method for manufacturing the copper porous composite part. [0002] This application claims priority based on Patent Application No. 2015-119694 for which it applied in Japan on June 12, 2015, and uses the content here. Background technique [0003] The above-mentioned copper porous body and copper porous composite member are used, for example, as electrodes and current collectors in various batteries, members for heat exchangers, sound-absorbing members, filters, impact-absorbing members, and the like. [0004] For example, Patent Document 1 proposes a porous metal body in which the surface of a porous metal body with a three-dimensional network structure is modified into a porous metal film. [0005] Furthermore, P...

Claims

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Application Information

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IPC IPC(8): B22F3/11B22F1/00B22F7/04C22C9/00C22F1/08C22F1/00F28F1/10B22F1/062
CPCC22C9/00C22F1/00C22F1/08F28F1/10B22F7/004B22F7/062C22C47/20Y10T428/12153B22F3/1103B22F3/1143B32B15/01B22F1/00B22F1/062B22F3/11B22F7/04C22C9/02B22F2301/10B22F7/002
Inventor 喜多晃一加藤纯幸俊彦
Owner MITSUBISHI MATERIALS CORP
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