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Method for processing semiconductor wafer and protective cover for covering semiconductor wafer

A semiconductor and cover technology, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, working carriers, etc., can solve problems such as difficulty in processing, and achieve the effect of cost saving

Active Publication Date: 2018-01-26
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the non-planar rear side of the stack makes further processing difficult and requires additional cutouts, for example when wafer clamps are applied

Method used

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  • Method for processing semiconductor wafer and protective cover for covering semiconductor wafer
  • Method for processing semiconductor wafer and protective cover for covering semiconductor wafer
  • Method for processing semiconductor wafer and protective cover for covering semiconductor wafer

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Embodiment Construction

[0141] In the following detailed description, with reference to the attached drawings, the drawings form a part of the description, and for the purpose of illustration, the drawings show specific embodiments in which the present can be implemented. invention. In this regard, directional terms such as "above", "below", "front", "rear", "front", "rear", etc. are used with reference to the orientation of the described drawing(s). Because the components of the embodiments can be positioned in many different orientations, the directional terminology is used for illustration and is not limited in any way. It should be understood that other implementations can be used and structural or logical changes can be made without departing from the protection scope of the present invention. It should be understood that the features of the different exemplary embodiments described herein can be combined with each other as long as there is no special description otherwise. Therefore, the follo...

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PUM

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Abstract

In various embodiments, a method for processing a semiconductor wafer (102, 202) is provided. The semiconductor wafer includes a first main processing side (102t) and a second main processing side (102b), which is arranged opposite the first main processing side (102t), and at least one circuit region (102s) having at least one electronic circuit on the first main processing side (102t). The method includes forming a stiffening structure (106), which at least partly surrounds the at least one circuit region (102s) and which stiffens the semiconductor wafer (102, 202), wherein the stiffening structure (106) has a cutout (106a) at least above part of the at least one circuit region (102s), and thinning the semiconductor wafer (102, 202), including the stiffening structure (106), from the second main processing side (102b).

Description

Technical field [0001] The present invention relates to a method for processing a semiconductor wafer or a plurality of semiconductor wafers and a protective cover for covering the semiconductor wafer. Background technique [0002] Generally, in semiconductor technology, semiconductor chips (also referred to as integrated circuits, ICs, chips, or microchips) can be processed, divided, and embedded in wafers (or substrates or carriers) and / or on wafers. The finished chip (e.g. an embedded integrated circuit) can be mounted in or on a carrier and contacted to provide a specific function, such as switching current. In order to reduce the resistance loss of the chip, which reduces its power consumption especially at high currents, the chip as a whole can be made as thin as possible so that the vertical current path through the chip is as short as possible. In order to manufacture such chips, correspondingly thin wafers are required, such as for the manufacture of metal oxide semicon...

Claims

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Application Information

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IPC IPC(8): H01L21/30H01L21/77H01L27/04
CPCH01L2221/68381H01L2221/6834H01L21/6835H01L2221/68327H01L21/6836B24B37/32H01L21/67383H01L21/30625
Inventor 弗朗西斯科·哈维尔·桑托斯罗德里格斯罗兰德·鲁普
Owner INFINEON TECH AG