Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor laser module and packaging method thereof

A packaging method and laser technology, applied in the direction of semiconductor lasers, lasers, laser components, etc., can solve the problems of high power of laser chips, affecting device reliability, high current density, etc., and achieve large contact area, improve reliability, and heat dissipation fast effect

Inactive Publication Date: 2018-02-02
SUZHOU EVERBRIGHT PHOTONICS CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high power of the laser chip and the high current density passing through it, the lead wires of the traditional microchannel water-cooled semiconductor laser module often break during use, which causes the device to burn out and seriously affects the reliability of the device.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor laser module and packaging method thereof
  • Semiconductor laser module and packaging method thereof
  • Semiconductor laser module and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings and examples, so as to fully understand and implement the process of how to apply technical means to solve technical problems and achieve technical effects in the present invention. It should be noted that, as long as there is no conflict, each embodiment and each feature in each embodiment of the present invention can be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.

[0026] Such as Figure 1-4 As shown, the embodiment of the present application provides a semiconductor laser module, which includes: a microchannel heat sink 1 , a laser chip 2 , an insulating adhesive film 3 , a first cathode sheet 4 and a second cathode sheet 5 .

[0027] In the embodiment of the present application, the positive electrode of the laser chip 2 is connected to the negative electrode of the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a semiconductor laser module and a packaging method thereof. The module comprises a microchannel heat sink (1), a laser chip (2), an insulating adhesive film (3), a first cathode sheet (4) and a second cathode sheet (5). The positive electrode of the laser chip (2) is connected with the microchannel heat sink (1) in a soldering way through a first solder. The negative electrode of the laser chip (2) is connected with the first cathode sheet (4) in a soldering way through a second solder. The first cathode sheet (4) is connected with the second cathode sheet (5). The insulating adhesive film (3) is arranged between the second cathode sheet and the microchannel heat sink. Compared with the conventional lead bonding mode, the packaging method is simple in technology, the contact area of the connection mode of the negative electrode of the laser chip and the first cathode sheet through the solder is large and heat radiation is fast without the situation of device burnout caused by disconnection so that the stability and the reliability of the device can be enhanced.

Description

technical field [0001] The invention belongs to the field of laser testing, and belongs to a semiconductor laser module and a packaging method thereof. Background technique [0002] At present, semiconductor laser modules can be divided into micro-channel water cooling, macro-channel water cooling and conduction cooling according to cooling methods. The microchannel water-cooled semiconductor laser module includes a microchannel heat sink, a laser chip, an insulating adhesive film, and a cathode sheet. Between the cathode sheet and the microchannel heat sink, it plays an insulating role. However, due to the high power of the laser chip and the high current density passing through it, the lead wires of the traditional microchannel water-cooled semiconductor laser module often break during use, which causes the device to burn out and seriously affects the reliability of the device. Contents of the invention [0003] The technical problem to be solved by the present inventi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024H01S5/042H01S5/022
CPCH01S5/02423H01S5/0425H01S5/0237
Inventor 朱滨
Owner SUZHOU EVERBRIGHT PHOTONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com