A semiconductor chip self-alignment pendulum

Abstract

The invention discloses a self-aligning pendulous reed for a semiconductor chip, belongs to the field of the photoelectronic technique, and can be used for the placing and alignment of a semiconductorlight-emitting device chip. An alignment bar is set in the longitudinal direction of the surface of a silicon chip substrate, and the silicon chip substrate is provided with a series of etching slotswhich are the same. The etching slots are arranged in the lateral direction of the surface of the silicon chip substrate. A heat sink is placed on the silicon chip substrate, and an overturning plateis placed on the heat sink. A side edge of the heat sink is aligned with a side edge of a tube core placing in the etching slot. The pendulous reed is simpler in structure, and is lower in design andmanufacturing cost. The pendulous reed is simple, and does not need other redundant devices. The overall size of the pendulous reed is far less than the size of a conventional pendulous reed clampingtool, so the whole pendulous reed can be placed in a nitrogen cover for operation, thereby reducing the oxidation of a cavity surface. Meanwhile, the devices employed by the pendulous reed do not contain metal, so the operation is cleaner.

Description

technical field [0001] The invention relates to a semiconductor chip self-alignment pendulum and a sintering method thereof, which belong to the field of optoelectronic technology and can be applied to placement and alignment of semiconductor light-emitting device chips. Background technique [0002] Semiconductor laser is a new type of optical device with small size, simple structure and low price. Since its appearance, it has triggered technological changes in many fields, and has triggered technological changes in many fields such as optical communication, Internet, information storage, laser processing, and laser display. , formed a new high-tech industrial cluster, and achieved huge economic and social benefits. Since the semiconductor laser has the characteristics of small size and high power, the heat dissipation of the die is a key factor affecting the life and stability of the semiconductor laser. The widely used solution is to sinter the semiconductor laser tube c...

AI Technical Summary

Problems solved by technology

Commonly used sintering equipment with manual swing and suction nozzle pressurization is single-point pressurization, the pressure is uneven, and the solder will have a certain fluidity when melting, which will cause sintering voids between the heat sink and the shell.

[0003] The structure of the conventional sintering fixture is as complicated as the patent 201520453486.4

The fixture with a relatively simple structure can only place one die at a time, which is inefficient, such as patent 201610285100.2

At the same time, the above equipment is not suitable for operation in a nitrogen hood, and it is prone to the problem of cavity surface oxidation, which will affect the pass rate and yield of the laser.

Moreover, the general swing device needs to turn the die with the P side down, and these operations will cause mechanical damage

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