Multi-station plasma spraying equipment for tungsten-copper electronic encapsulation
A technology of electronic packaging and spraying equipment, which is applied in the direction of coating, molten spraying, metal material coating technology, etc., can solve the problems of increasing product processing cycle, increasing the cost of enterprise employment, and frequent operation, so as to reduce the product processing cycle , Reduce the cost of enterprise employment and save workers' time
Inactive Publication Date: 2018-02-16
WUHU DINGHENG MATERIAL TECH
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Problems solved by technology
However, although this method realizes the mechanized automatic processing process, the number of workpieces processed each time is small, and the loading of the workpieces needs to be completed manually, the operation is frequent, and the plasma equipment needs to be stopped in the loading diagram of the workpieces, which seriously reduces the work efficiency. , increase the cost of enterprise employment, increase the product processing cycle
Method used
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[0020] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below.
[0021] like Figure 1 to Figure 5 As shown, a multi-station plasma spraying equipment for tungsten-copper electronic packaging includes a base plate 1, a plasma spraying machine 2 fixed on the left end of the base plate 1, a mounting table 3 fixed on the right end of the base plate 1, and a horizontal sliding installation on the mounting table 3 A base 4, the left end and the right end of the base 4 are respectively equipped with a No. 1 lead screw 5 and a No. 2 lead screw 6, and the front part of the No. There is a tooling 7 slidably installed on the base 4, the rear end of the No. 1 screw 5 and the rear end of the No. 2 screw 6 are connected with a cross-belt transmission mechanism 8, and one end of the cross-belt transmission mechanism 8 is connected to On the No. 1 leading screw 5 ...
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The invention relates to multi-station plasma spraying equipment for tungsten-copper electronic encapsulation. The multi-station plasma spraying equipment comprises a bottom plate, a plasma spraying machine, an installing table and a base table, and the base table is slidably installed on the installing table; a first lead screw and a second lead screw are installed on the base table, toolings which are slidably installed on the base table are connected to the first lead screw and the second lead screw, a cross belt transmission mechanism is connected to the first lead screw and the second lead screw, and a driving mechanism connected with the tooling on the first lead screw is installed on the base table; the driving mechanism comprises a motor, an driving bevel gear and a micro rotatingmotor; and a first bevel gear is connected to the first lead screw, a pinion is connected to the first bevel gear, and a long rack which is engaged with the pinion is fixed on the installing table. According to the multi-station plasma spraying equipment for tungsten-copper electronic encapsulation, installing of a plurality of workpieces during one-time feeding process can be achieved, the operation process is simplified, continuous processing and manufacturing can be achieved, the working efficiency is improved, the employing cost of an enterprise is reduced, the product processing cycle isreduced, the whole equipment has the compact layout, the size is small, and operation is simple and convenient.
Description
technical field [0001] The invention relates to the technical field of tungsten-copper processing machinery, in particular to a multi-station plasma spraying equipment for tungsten-copper electronic packaging. Background technique [0002] In the process of tungsten copper processing and electronic packaging, it is necessary to process the agglomerated high-purity tungsten powder and copper powder after sintering by plasma spraying, and spray the workpieces one by one through plasma spraying equipment. However, although this method realizes the mechanized automatic processing process, the number of workpieces processed each time is small, and the loading of the workpieces needs to be completed manually, the operation is frequent, and the plasma equipment needs to be stopped in the loading diagram of the workpieces, which seriously reduces the work efficiency. , Increase the cost of enterprise employment and increase the product processing cycle. Contents of the invention ...
Claims
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Login to View More IPC IPC(8): C23C4/134
CPCC23C4/134
Inventor 程敬卿
Owner WUHU DINGHENG MATERIAL TECH