Accuracy consistency correction method and system for batch testing of multiple testing equipment

Abstract

The invention relates to a method and system for correcting the accuracy consistency of batch testing through multiple test devices. The method comprises the steps of testing calibration elements by using multiple test devices and obtaining relative correction factors of the test devices according to the tested values, wherein each test device is provided with one calibration element and the accuracy of the calibration elements is higher than the test accuracy of the multiple test devices; carrying out batch testing on to-be-tested elements by using the multiple test devices and taking the values which are directly read from the test devices as measured values of the to-be-tested elements; and correcting the measured values through the relative correction factors, used by the to-be-testedelements, of the test devices to obtain actual values of the to-be-tested elements. According to the method and system for correcting the accuracy consistency of batch testing through the multiple test devices, accuracy machining of the to-be-tested elements is ensured through the relative correction factors of the test devices, the machining accuracy of the to-be-tested elements can be ensured without adjusting the test devices to the accuracy standard of a standard machine one by one, time and labor are saved and the machining efficiency is obviously improved.

Description

technical field [0001] The invention relates to the field of high-precision testing and processing, in particular to a precision consistency correction method and system for batch testing of multiple testing equipment. Background technique [0002] In the mass production process of integrated circuit wafer testing, the number of wafers in a batch ranges from a few to hundreds or even thousands of wafers, which need to be processed on multiple test equipment to meet the production capacity requirements. Minor differences in accuracy will exist between different test equipment, and these differences are within the rated accuracy of the equipment. For wafers with low precision requirements, usually, this difference will not affect the batch processing and production of wafers. However, in some situations where high precision is required, the precision difference between test equipment will seriously affect the normal batch production of wafers. The current practice is to use ...

AI Technical Summary

Problems solved by technology

However, in some situations where high precision is required, the precision difference between test equipment will seriously affect the normal batch production of wafers

The current practice is to use the same wafer sample whose accuracy meets the requirements to test each test equipment separately, and manually adjust the accuracy of each test equipment until the accuracy of the test equipment meets the requirements; The growth and multiple electrical shocks, the performance will have obvious drift, and it is sensitive to temperature, the stability is relatively poor, and it needs to be replaced regularly

This method of manually adjusting the accuracy of the test equipment to ensure the accuracy of the wafer is time-consuming and laborious, which seriously affects production efficiency

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