Solder resist composition, film, covered printed wiring board, method for producing film, and method for producing covered printed wiring board
A technology of printed wiring board and composition, which is applied in the directions of secondary treatment of printed circuit, photoplate-making process of pattern surface, and exposure device of photoplate-making process, etc. Insufficient adhesion and other problems, to achieve the effect of excellent recognition
Active Publication Date: 2019-07-16
GOO CHEM IND
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- Application Information
AI Technical Summary
Problems solved by technology
[0005] However, in the covered wiring board described in Patent Document 1, since a double-layer coating film consisting of a first coating film and a second coating film is formed on the printed wiring board, the productivity is reduced.
In addition, since the overall film thickness of the film covering the printed wiring board is thick, it is difficult for exposure (UV light) to sufficiently reach the deep part from the surface layer of the double-layer film when producing a covered wiring board.
As a result, the hardening of the film may become insufficient, and the adhesion between the printed wiring board and the second-layer film may be insufficient.
Method used
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Embodiment
[0166] Hereinafter, the present invention will be specifically described by way of examples.
[0167] [Preparation of carboxyl-containing resin solution]
[0168] In a four-necked flask equipped with a reflux cooling pipe, a thermometer, an air inlet pipe and a stirrer, add cresol novolak type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name YDCN-700-5, epoxy equivalent 203) 203 parts by mass, 103 parts by mass of diethylene glycol monoethyl ether acetate, 0.2 parts by mass of methylhydroquinone, 72 parts by mass of acrylic acid, and 1.5 parts by mass of triphenylphosphine to prepare a mixture. This mixture was heated at a heating temperature of 110° C. for a heating time of 10 hours to perform an addition reaction. Next, 60.8 parts by mass of tetrahydrophthalic anhydride and 78.9 parts by mass of diethylene glycol monoethyl ether acetate were added to the mixture, and the mixture was further heated at a heating temperature of 80° C. and a he...
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Abstract
The solder resist composition according to the present invention contains: a carboxyl group-containing resin (A); a photopolymerizable compound (B) containing at least one kind selected from the group consisting of photopolymerizable monomers and photopolymerizable prepolymers; a photopolymerization initiator (C); crystalline epoxy resin (D) having a melting point of 130°C or higher; and a blue dispersant (E).
Description
technical field [0001] The present invention relates to a solder resist composition, a film, a covered printed wiring board, a method for producing the film, and a method for producing a covered printed wiring board. Background technique [0002] A film such as a solder resist layer is formed on a printed wiring board in order to protect wiring and prevent short circuits during component mounting. In addition, characters, symbols, etc. indicating product information and the like may be marked on printed wiring boards. [0003] A covered wiring board in which a second coating and a first coating are sequentially formed on a printed wiring board is known as a coated wiring board excellent in mark visibility (Japanese Patent No. 5643416). The second film functions as a colored layer. The first film includes a first region and a second region having higher light transmittance than the first region. The first film is formed from a photosensitive film-forming composition contai...
Claims
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IPC IPC(8): G03F7/027G03F7/004G03F7/20G03F7/40H05K3/28
CPCG03F7/004G03F7/027G03F7/20G03F7/40H05K3/28
Inventor 樋口伦也丸泽尚荒井贵
Owner GOO CHEM IND