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High frequency induction heating device

A high-frequency induction heating, high-frequency power supply technology, applied in dielectric heating, microwave heating, dielectric heating circuits, etc., can solve the problems of low power supply efficiency, high anode voltage, difficult impedance matching, etc., to suppress the damage of the power supply , the effect of suppressing reflected power and improving oscillation efficiency

Active Publication Date: 2021-08-31
TOYO SEIKAN GRP HLDG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the vacuum tube type high-frequency power supply has the following problems: on the basis of the characteristics of power amplification, its anode voltage is high, and it is large, and the power supply efficiency is low. The cost of the device is increased, and waste heat from the filament is required, and it takes a certain amount of time to start the device. In addition, there is a problem that the resonance frequency changes arbitrarily due to the electrode impedance of the object to be heated.
However, in the configuration in which the third capacitor C3 is a variable-capacitance capacitor and its value is gradually changed, since the electrode impedance also gradually changes accordingly, in particular, the load between the electrodes 30 is like a food material. In the case of such a large capacity and a large change in electrode impedance due to shape, type, heating or thawing temperature, the change will be promoted, making it difficult to perform impedance matching stably
Moreover, in order to maintain the impedance matching in the state where the electrode impedance is unstable, it is necessary to make the first capacitor C1 have a large impedance adjustment range, so that there will be problems that the size of the matching device 40 increases and the cost increases.

Method used

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Examples

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no. 1 Embodiment

[0062] Next, a first experimental example of the present invention will be described.

[0063] In the first experimental example, the impedance of the reactance circuit 50 was adjusted by adjusting the frequency of the high-frequency power supply 20 by setting the capacity of the second capacitor C2 of the reactance circuit 50 to 93 pF and the inductance of the coil L to 1.8 μH. In addition, the capacity of the third capacitor C3 is set to 400 pF. In addition, the high-frequency power supply 20 is configured to stop the high-frequency output by a protection function when the reflectance detected by the reflected power detection unit exceeds 40%. In addition, frozen persimmons (four pieces) were used as objects to be thawed (objects to be heated) arranged between the pair of electrodes 30 .

[0064] image 3 Yes: The results obtained by measuring the frequency and reflectance every 1 minute after the start of thawing.

[0065] As a case where matching adjustment is not perfo...

no. 2 Embodiment

[0080] Next, a second experimental example of the present invention will be described.

[0081] figure 2 What (a) shows is the value (capacity %) when the following situation, namely: the frequency of high-frequency power supply 20=13.56MHz, the output impedance of high-frequency power supply 20=50Ω, the capacity C of the first capacitor C1 1 =1500pF, the capacity C of the second capacitor C2 with variable capacity 2 = 25 to 250pF, inductance L of coil L = 1.8μH, defrosting various foods, in order to always minimize the reflected power detected by the reflected power detection unit, the capacity of the second capacitor C2 is adjusted.

[0082] When the third capacitor C3 is not connected, the capacity % of C2 at the start of thawing varies depending on the type and number of ingredients, and the capacity % of the second capacitor C2 at the end of thawing changes greatly in the direction of decrease. That is, unless the capacity variable range of the second capacitor C2 is i...

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Abstract

The present invention provides a high-frequency induction heating device capable of reducing the cost of the device and simplifying the structure of the device, and enabling fine adjustment of impedance with high precision and easily. The high-frequency induction heating device (10) includes: a high-frequency power supply (20), a pair of electrodes (30) arranged opposite to each other, connected between the electrodes (30) and the high-frequency power supply (20), and for heating the object to be heated And the reflected power detecting mechanism that the reflected power that produces detects, and the impedance matching device (40) that the reflected power is adjusted, the impedance matching device (40) has: the capacitor (C1) that is connected in parallel with the high-frequency power source (20), And at least one of a capacitor (C2) capable of adjusting reactance or a coil (L) connected in series with the electrode (30), and the high-frequency power supply (20) are configured to be variable in frequency.

Description

technical field [0001] The present invention relates to a high-frequency induction heating device that uses high-frequency induction heating to heat an object to be heated disposed between opposing electrodes, and particularly relates to a high-frequency induction heating device that uses high-frequency induction heating to thaw frozen foodstuffs. High frequency induction heating device. Background technique [0002] As is well known, conventionally, as a high-frequency induction heating device for heating an object to be heated by high-frequency induction heating, there are: device (for example, refer to Patent Document 1). The so-called high-frequency induction heating refers to: applying a high-frequency voltage to the object to be heated (inductor), using high frequency to change the polarity of each molecule constituting the object to be heated, and the accompanying molecular rotation, collision, vibration, A heating method in which the object to be heated can be heat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B6/50H05B6/64
CPCH05B6/50H05B6/64H05B6/54
Inventor 丸山友树山田真司
Owner TOYO SEIKAN GRP HLDG LTD
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