Anti-static additive for anti-static adhesive tape

Abstract

The invention discloses an anti-static additive for an anti-static adhesive tape. The anti-static additive is characterized in that a PET (Polyethylene Terephthatate) thin film which is 0.025 mm in thickness is used as a basic layer, the surface of the PET thin film is coated with organic silica gel which is 0.02 mm in thickness, and anti-static additive is uniformly dispersed in the organic silica gel; the anti-static additive is prepared from the following raw materials in weight proportions through mixing: 3 parts of mineral oil, 5 parts of calcium carbonate powder, 0.2 part of silicone oiland 0.01 part of silver chloride. The anti-static adhesive tape prepared by the invention has anti-acid / alkaline, anti-wear and anti-static functions, can be used under various different weather andhumidity conditions, and is high in economic benefit, low in cost and long in service life.

Description

Technical field: [0001] The invention relates to the technical field of adhesive tapes, in particular to an antistatic additive for antistatic adhesive tapes. Background technique: [0002] With the rapid development of electronic technology, the gradual reduction of the physical size of integrated circuits, the continuous improvement of integration, and the widespread use of more new polymer materials, electrostatic discharge has become increasingly important, and the problem of electrostatic protection has become more and more important. for widespread attention. So far, the FPC (abbreviation: flexible circuit board) manufacturing process is almost all processed by subtractive method (etching method). Usually, copper clad board is used as the starting material, and the resist layer is formed by photolithography, and the unnecessary parts are etched away. The copper surface of the circuit board is formed into a circuit conductor, and then the cover film is pressed under hi...

AI Technical Summary

Problems solved by technology

[0003] At present, some high-temperature-resistant antistatic additives for antistatic tapes on the market still have the following problems: (1) Introduce ionic additives into the interlayer between the adhesive layer and the substrate, and its electrostatic conductivity mainly depends on the humidity in the environment. In a high temperature environment, it will not be able to play a normal antistatic effect; (2) Introduce ionic additives into the adhesive layer, because these ionic additives will directly contact with the PI surface, and there will be migration from the inner layer of the adhesive layer to the surface of the adhesive layer and transfer to The risk on the PI surface will pollute the PI surface; (3) Introduce conductive metal particles or polymer particles into the adhesive. Although it can maintain the static conductive function, the introduction of these conductive particles will affect the adhesion. Some properties of the agent itself, such as reducing cohesive strength, wear resistance, acid and alkali resistance, etc.