Acid and alkali-resistant adhesive tape calendaring molding method

Abstract

The invention discloses an acid and alkali-resistant adhesive tape calendaring molding method which comprises the following steps: (1) weighing polystyrene, acrylamide, polyvinyl chloride, nano silicon dioxide, a silane coupling agent, a lubricating agent, an adhesive and a softening agent according to the formula ratio; (2) after the polystyrene, the acrylamide and the polyvinyl chloride are weighed according to the ratio, mixing, firstly adding poly-polypropylene and then adding the acrylamide and the polyvinyl chloride; (3) kneading the polystyrene, the acrylamide and metal polyethylene tobe pasty at a high speed, uniformly adding the nano silicon dioxide, the silane coupling agent, the lubricating agent, the adhesive and the softening agent while high-speed kneading is performed, andkneading for 60-80 minutes; (4) extrusion-molding, wherein the extrusion temperature is 170-190 DEG C; (5) calendaring molding, wherein the calendaring temperature is 190-200 DEG C; (6) automaticallycutting.

Description

Technical field: [0001] The invention relates to the technical field of adhesive tapes, in particular to an acid and alkali resistant adhesive tape calendering forming method. Background technique: [0002] With the rapid development of electronic technology, the gradual reduction of the physical size of integrated circuits, the continuous improvement of integration, and the widespread use of more new polymer materials, electrostatic discharge has become increasingly important, and the problem of electrostatic protection has become more and more important. for widespread attention. So far, the FPC (abbreviation: flexible circuit board) manufacturing process is almost all processed by subtractive method (etching method). Usually, copper clad board is used as the starting material, and the resist layer is formed by photolithography, and the unnecessary parts are etched away. The copper surface of the circuit board is formed into a circuit conductor, and then the cover film is...

AI Technical Summary

Problems solved by technology

[0003] At present, some high-temperature resistant antistatic tapes on the market still have the following problems: (1) Introduce ionic additives into the interlayer between the adhesive layer and the substrate, and its electrostatic conductivity mainly depends on the humidity in the environment. In a high-temperature environment, it will not be able to Play a normal antistatic effect; (2) Introduce ionic additives into the adhesive layer, because these ionic additives will be in direct contact with the PI surface, and there is a risk of migrating from the adhesive layer to the adhesive layer surface and transferred to the PI surface, Contaminate the PI surface; (3) Introduce conductive metal particles or polymer particles into the adhesive. Although it can maintain the static conductive function itself, due to the introduction of these conductive particles, some properties of the adhesive itself will be affected. Such as reducing cohesive strength, wear resistance, acid and alkali resistance, etc.