PCB rapid in heat dissipation

A fast, heat sink technology, applied in the direction of circuit heating devices, printed circuit components, electrical components, etc., can solve the problem of low heat dissipation performance of PCB, achieve the effect of improving heat dissipation performance, saving external space, and reducing overall size
CN107734837AActive Publication Date: 2018-02-23DONGGUAN SHENGYI ELECTRONICS
4 Cites 7 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
DONGGUAN SHENGYI ELECTRONICS
Publication Date
2018-02-23

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to the field of circuit boards, and discloses a PCB rapid in heat dissipation. The PCB comprises a stepped groove and a stepped high-thermal-conductivity metal block which is arranged in the stepped groove, and solder paste is arranged between the top surface of the stepped high-thermal-conductivity metal block and a high-power component on the surface of the PCB; a conductive heat-conducting adhesive sheet is arranged between the shoulder of the stepped high-thermal-conductivity metal block and a metal layer adjacent to the stepped high-thermal-conductivity metal block.The stepped groove is formed in the PCB and the stepped high-thermal-conductivity metal block is embedded in the stepped groove so that heat generated by the high-power component and the metal layer in the PCB can be transmitted into air through the stepped high-thermal-conductivity metal block in time, the heat dissipation performance of the PCB is improved, the structure is simple, and the PCB is more convenient to process and install.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the field of circuit boards, in particular to a PCB with rapid heat dissipation. Background technique

[0002] PCB (Printed Circuit Board), that is, printed circuit board, is the provider of electrical connections for electronic components. The multi-layer PCB is made by pressing the core board and the prepreg. With the development of electronic product technology, the trend of surface mount and miniaturization of components is becoming more and more obvious, the density of products is increasing, the main frequency of components is increasing, and the power consumption of individual components is gradually increasing, resulting in the increase of heat flux density. sharply increased. Therefore, in order to ensure the service life of electronic equipment, it is necessary to solve the problem of heat dissipation of high-power components.

[0003] The heat dissipation problem at the mounting position of high-power components c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More