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Evaporation device and evaporation method

A technology of evaporation and evaporation source, which is applied in the directions of vacuum evaporation plating, sputtering plating, ion implantation plating, etc., which can solve the problems of large range of plating rate jump, poor plating rate monitoring effect, false plating rate, etc. , to achieve the effect of steady evaporation rate

Active Publication Date: 2019-12-03
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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AI Technical Summary

Problems solved by technology

After a period of time after heating, Li 2 O and Li 3 N will be evaporated and deposited on the crystal oscillator of the plating rate monitoring device, Li 2 O. Li 3 The densities of N and Li are different, but since the plating rate monitoring device calculates the plating rate according to the density of Li, there will be situations of unstable plating rate monitoring and false plating rates
[0008] figure 1 For the plating rate curve of lithium (Li) monitored by the plating rate monitoring device in the existing vapor deposition process, such as figure 1 As shown, since Li 2 O and Li 3 N will also be vapor deposited on the crystal oscillator of the plating rate monitoring device, so the Li plating rate monitored by the plating rate monitoring device has a relatively large jumping range, and the plating rate monitoring effect is not good.

Method used

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  • Evaporation device and evaporation method
  • Evaporation device and evaporation method

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Embodiment Construction

[0044] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0045] see Figure 2 to Figure 4 , the present invention firstly provides an evaporation device, comprising: a chamber body 10, an evaporation source 20 disposed in the chamber body 10, a waiting device disposed in the chamber body 10 and above the evaporation source 20 a coating substrate 30, and a coating rate monitoring device 40 disposed in the cavity 10 and above the evaporation source 20;

[0046] Described plating rate monitoring device 40 comprises crystal oscillator plate 41; Described crystal oscillator plate 41 is the probe of described plating rate monitoring device 40, and described plating rate monitoring device 40 is deposited on crystal oscillator plate 41 by the vapor deposition of the material film layer The rate is monitore...

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Abstract

The invention provides an evaporation device and an evaporation method. The vapor deposition device of the present invention is provided with a crystal vibrating plate shielding plate between the evaporation source and the crystal vibrating plate, and the crystal vibrating plate shielding plate can be switched between the two positions of shielding the crystal vibrating plate and not shielding the crystal vibrating plate; When the position of the crystal oscillator is not blocked, the evaporation material is deposited on the crystal oscillator plate, thereby avoiding the evaporation material from being deposited on the crystal oscillator plate; when the crystal oscillator plate shielding plate is in a position that does not block the crystal oscillator plate, the evaporation material can be deposited on the crystal oscillator plate; the present invention When the evaporation device is applied to the evaporation process, in the initial stage of evaporation, that is, the evaporation stage of the surface impurities of the material to be evaporated, the crystal oscillator shielding plate is in the position of blocking the crystal oscillator to prevent impurities from depositing on the surface of the crystal oscillator; After the impurities on the surface of the evaporation material are evaporated, the shielding plate of the crystal oscillator is in a position not to block the crystal oscillator, the evaporation material is deposited on the surface of the crystal oscillator, and the deposition rate monitoring device obtains a stable evaporation rate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an evaporation device and an evaporation method. Background technique [0002] Vacuum evaporation is an important thin film forming technology, which is widely used in industrial fields such as displays, electronic circuits, optics, and molds. For example, in organic light-emitting diode (OLED) display technology, organic materials are processed by vacuum evaporation. Film formation with metal materials to produce OLED components. [0003] The basic process of evaporation is as follows: the evaporation material is placed in the crucible of the evaporation chamber, and the chamber is evacuated to a certain degree of vacuum (E -5 After Pa), the crucible is heated to make the evaporation material reach a certain temperature, and the gas molecules of the evaporation material are ejected from the crucible, deposited on the substrate to form a target film, and also deposited on the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/54
CPCC23C14/24C23C14/546C23C14/14C23C14/564C23C14/243
Inventor 刘扬
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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