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Evaporation device and method

An evaporation and substrate technology, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve problems such as aggravation, poor evaporation, unstable evaporation, etc., to improve position accuracy and good adsorption Effects of Intensity and Switch Control

Active Publication Date: 2018-03-20
BOE TECH GRP CO LTD +1
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Problems solved by technology

[0003] When the existing evaporation device performs evaporation on the substrate to be evaporated, the substrate to be evaporated is usually installed horizontally on the substrate carrier. Since the current metal mask is adsorbed by permanent magnets distributed in a large area, the whole makes it stick to the evaporation substrate. Combined, because the material of the metal mask is thin, there are different degrees of wrinkles, and the wrinkled area cannot be released or aggravated when it is absorbed by the whole, resulting in poor evaporation, and at the same time, the evaporation instability is different in each adsorption

Method used

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  • Evaporation device and method
  • Evaporation device and method

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Embodiment Construction

[0012] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0013] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0014] Please refer to figure 1 , an embodiment of the present invention provides an evaporation device, including an evaporation substrate carrier 5, the evaporation substrate carrier 5 is used to carry an evaporation substrate 6, and the evaporation substrate 6 is located on the evaporation subs...

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Abstract

The invention discloses an evaporation device and method. The evaporation device comprises an evaporation base plate carrier. The evaporation base plate carrier is used for carrying an evaporation base plate. An electromagnetic module is arranged in the position, above the zone where the evaporation base plate is located, of the evaporation base plate carrier and comprises a plurality of electromagnetic units. The multiple electromagnetic units are used for energizing according to a preset sequence. According to the technical scheme provided by the invention, by arranging the multiple electromagnetic units for adsorbing metal masks, the problem that the whole metal masks are adsorbed, and consequently the metal masks are winkled or cannot be released due to winkling can be solved, meanwhile, the adsorption strength and switching can be better controlled through the electromagnetic units, and the position precision of patterns on the evaporation base plate can be improved.

Description

technical field [0001] The present disclosure generally relates to the field of vapor deposition technology, and in particular, to a vapor deposition device and a vapor deposition method. Background technique [0002] The vacuum evaporation coating method (referred to as the vacuum evaporation method) is to heat the evaporation material through the evaporation source in the vacuum evaporation chamber, so that the atoms or molecules of the evaporation material vaporize and escape from the surface to form a vapor flow, which is incident on the A method of condensing and forming a solid film on the surface of the substrate to be evaporated. The vacuum evaporation method has been widely used in the manufacturing process of display devices, such as the cathode, anode and luminescent material layer between the cathode and anode of OLED (Organic Light-Emitting Diode) display panel. [0003] When the existing evaporation device evaporates the substrate to be evaporated, the substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/50C23C14/04
CPCC23C14/042C23C14/24C23C14/50
Inventor 杨成发尹志王琦黄俊杰
Owner BOE TECH GRP CO LTD
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