Function module heat dissipation structure and case

Abstract

The invention relates to the technical field of communication network equipment and in particular relates to a function module heat dissipation structure and a case. The function module heat dissipation structure disclosed by the invention comprises a power amplifier base board used for being mounted on the case, wherein a PCB (Printed Circuit Board) with a power amplifier module is connected ontothe power amplifier base board; a power amplifier shell covers the PCB; a protruding part is arranged on the outer edge of the power amplifier shell and extends along a board surface direction of thePCB, and the extension direction of the protruding part is far away from the center of the shell; and the protruding part simultaneously extends to inner walls of the case and is contacted with the inner walls of the case. According to the function module heat dissipation structure, the structural form of the existing circuit system is changed, so that effective heat transfer is performed betweenthe circuit system and the case, and the aims of improving the heat dissipation efficiency and accelerating heat dissipation are achieved. The heat dissipation structure is stable and reliable, the heat can be rapidly and continuously dissipated, and normal operation of the circuit system is further protected, so that each function module, the PCB and the circuit system can continuously, efficiently and reliably work, and excellent functional characteristics are achieved.

Description

technical field [0001] The invention relates to the technical field of communication network equipment, in particular to a heat dissipation structure of a functional module and a chassis. Background technique [0002] In the communication network equipment, multiple functional modules are arranged on the PCB circuit board, and each functional module correspondingly realizes different functions. Meanwhile, the multiple functional modules constitute the entire circuit system to realize the overall function of the circuit system. Each functional module emits a large amount of heat during operation, and how to quickly dissipate heat and keep the temperature of the circuit system within a controllable and normal range has become a key consideration in the layout of the circuit system. [0003] In the circuit system, there are mainly two heat dissipation methods for functional modules. One is to exchange heat with the air and dissipate heat through the air. It is in a non-circula...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a heat dissipation structure for functional modules in view of the problems of slow heat dissipation and low heat dissipation efficiency of the shielding cover in the prior art circuit system, which will affect the normal operation of equipment and circuits after heat concentration, and even short circuit and burnout And the chassis, the heat dissipation structure of this functional module changes the existing circuit system structure, so that the circuit system and the chassis can carry out effective heat transfer, so as to improve the heat dissipation efficiency and accelerate the heat dissipation. The heat dissipation structure is stable and reliable, and can ensure rapid heat dissipation , continuously distributed, and then protect the normal operation of the circuit system, so that each functional module, PCB circuit board and circuit system can work continuously, efficiently and reliably, and play good functional characteristics

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