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Workpiece holder and workpiece cutting method

A technology of workpiece support and workpiece, applied in the direction of work accessories, electrical components, manufacturing tools, etc., to achieve the effect of improving productivity and low cost

Active Publication Date: 2018-03-27
SHIN-ETSU HANDOTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a deviation between the central axis of the shape of a generally cylindrical ingot and the normal line (crystal orientation axis) relative to the crystal plane.

Method used

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  • Workpiece holder and workpiece cutting method
  • Workpiece holder and workpiece cutting method
  • Workpiece holder and workpiece cutting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] use as figure 1 The workpiece support 1 of the present invention shown, complies with Figure 6 In the flowchart of the workpiece cutting method of the present invention shown, the workpiece was cut using a single crystal silicon ingot having a diameter of 200 mm and a crystal axis .

[0072] In Example 1, the workpiece plate 2 is adhesively fixed to the ingot so that the deviation in the x-axis direction of the crystal ingot with the crystal axis becomes 0 points, and the angle of the workpiece plate 2 is adjusted so that the deviation in the y-axis direction becomes 20 minutes to fix the ingot on the bracket body 4 . In this way, the crystal bar supported by the workpiece support 1 of the present invention is installed on the Figure 5 The wire saw 10 is shown for cutting.

Embodiment 2

[0074] The ingot was cut under the same conditions as in Example 1 except that the ingot to be cut was changed to an ingot having a crystallographic axis .

[0075] Table 1 shows the plane orientation, TTV, and warpage of the wafers cut out in Examples 1 and 2.

[0076] Table 1

[0077]

[0078] It can be known from Table 1 that in Examples 1-2, the difference between the target orientation and the measured value is less than 2 minutes in the x-axis direction, and less than 1 minute in the y-axis direction. Since this difference is generally about ±10 minutes, it can be said that a wafer with a plane orientation with good precision is cut out as expected.

[0079] In addition, with regard to the TTV or warpage of the wafer, the crystallization axis shaft member or the appropriate ingot cutting position is fixed by the known cutting method of the external setting method including the step of rotating the ingot on the support plate. When the single crystal ingot with the c...

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Abstract

The present invention provides a workpiece holder that is used when cutting a workpiece using a wire saw. The workpiece holder is provided with: a workpiece plate that is adhered and fixed to a workpiece with a back plate interposed therebetween; and a holder body that supports the workpiece plate. In a case where, among radial directions of the workpiece, the direction parallel to the workpiece adhesion surface of the workpiece plate is the x-axis direction and a direction perpendicular the workpiece adhesive surface is the y-axis direction, the workpiece plate corrects misalignment of a crystallographic orientation axis of the workpiece in the x-axis direction and is adhered and fixed to the workpiece. The workpiece holder adjusts a y-axis direction inclination of the workpiece held by the workpiece plate by inclining the workpiece plate in the y-axis direction and is able to fix the workpiece plate and the workpiece to the holder body at the adjusted inclination. Due to this configuration, there are provided a workpiece holder and a method of cutting a workpiece using the workpiece holder that can realize cutting of an ingot having strict directional standards for an external setup system.

Description

technical field [0001] The invention relates to a workpiece support and a cutting method of the workpiece. Background technique [0002] In recent years, workpieces such as single crystal silicon ingots are often cut into wafers using a wire saw. In cutting with a wire saw, first as Figure 7 As shown, the workpiece W to be cut is supported by the workpiece support 100 , and the workpiece support 100 has a workpiece plate 102 supporting the workpiece W through an abutment plate 103 , and a support body 104 supporting the workpiece plate 102 . Next, the workpiece support 100 supporting the workpiece W is mounted on the wire saw, and the workpiece W is pressed against the steel wire reciprocating in the axial direction and wound around the steel wire row formed by the roller with a plurality of grooves, and the workpiece W is cut into a wafer shape (for example, refer to Patent Document 1). jigsaw such as Figure 8 As shown in the side view in , the workpiece W is cut in th...

Claims

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Application Information

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IPC IPC(8): B24B27/06B28D5/04B28D7/04H01L21/304
CPCB28D5/045B28D5/0088B24B27/06B28D5/04B28D7/04H01L21/304
Inventor 渡边城康
Owner SHIN-ETSU HANDOTAI CO LTD