Workpiece holder and workpiece cutting method
A technology of workpiece support and workpiece, applied in the direction of work accessories, electrical components, manufacturing tools, etc., to achieve the effect of improving productivity and low cost
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Embodiment 1
[0071] use as figure 1 The workpiece support 1 of the present invention shown, complies with Figure 6 In the flowchart of the workpiece cutting method of the present invention shown, the workpiece was cut using a single crystal silicon ingot having a diameter of 200 mm and a crystal axis .
[0072] In Example 1, the workpiece plate 2 is adhesively fixed to the ingot so that the deviation in the x-axis direction of the crystal ingot with the crystal axis becomes 0 points, and the angle of the workpiece plate 2 is adjusted so that the deviation in the y-axis direction becomes 20 minutes to fix the ingot on the bracket body 4 . In this way, the crystal bar supported by the workpiece support 1 of the present invention is installed on the Figure 5 The wire saw 10 is shown for cutting.
Embodiment 2
[0074] The ingot was cut under the same conditions as in Example 1 except that the ingot to be cut was changed to an ingot having a crystallographic axis .
[0075] Table 1 shows the plane orientation, TTV, and warpage of the wafers cut out in Examples 1 and 2.
[0076] Table 1
[0077]
[0078] It can be known from Table 1 that in Examples 1-2, the difference between the target orientation and the measured value is less than 2 minutes in the x-axis direction, and less than 1 minute in the y-axis direction. Since this difference is generally about ±10 minutes, it can be said that a wafer with a plane orientation with good precision is cut out as expected.
[0079] In addition, with regard to the TTV or warpage of the wafer, the crystallization axis shaft member or the appropriate ingot cutting position is fixed by the known cutting method of the external setting method including the step of rotating the ingot on the support plate. When the single crystal ingot with the c...
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Abstract
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