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Hardener for epoxy resin and preparing method thereof

A technology of curing agent for epoxy resin, which is applied in the field of curing agent for epoxy resin and its preparation, and can solve the problems of high hygroscopicity of cured products, reduced mechanical properties, and inability to increase adhesive force.

Active Publication Date: 2018-04-03
SHIN A T&C CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, as a curing agent having the above active hydrogen, when curing an epoxy resin, a polar high hydroxyl group is generated by the reaction of the epoxy group and the active hydrogen, so there is a possibility that the hygroscopicity of the final cured product becomes high, and There is a problem that the electrical properties such as dielectric constant and dielectric loss are lowered, and the heat resistance is lowered due to the low glass transition temperature of the cured product, or the mechanical properties are lowered due to low peel strength, etc., and the above physical properties cannot be satisfied at the same time. question
[0007] In addition, even if one of the physical properties of the final cured product is good, the other will be intangibly reduced. Especially, as the electrical properties such as dielectric constant and dielectric loss decrease, there will be problems that cannot satisfy low moisture absorption, high heat resistance, and excellent mechanical properties at the same time. characteristics and excellent electrical characteristics
[0008] In Korean Patent Application No. 2011-0105763, an epoxy resin composition that can be usefully used as an adhesive and sealing material for electronic devices is disclosed, but in the case of a curing agent contained in the above composition, it cannot be achieved by using a conventional Amine-based curing agent to minimize the dielectric constant and dielectric loss, and the cured product has high hygroscopicity and cannot increase the adhesive force, so there is a problem that it cannot be used as a high-performance, highly integrated electrical and electronic material

Method used

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  • Hardener for epoxy resin and preparing method thereof
  • Hardener for epoxy resin and preparing method thereof
  • Hardener for epoxy resin and preparing method thereof

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preparation example Construction

[0098] Next, the present invention provides a method for preparing a curing agent for epoxy resin. The method for preparing a curing agent for epoxy resin includes: step 1, introducing the following chemical formula 2. A monomer represented by Chemical Formula 3 and Chemical Formula 4; and a step 2 of preparing a copolymer represented by the following Chemical Formula 1 by reacting the monomer introduced in the above-mentioned Step 1.

[0099] Chemical formula 2:

[0100] In the above chemical formula 2, a is a rational number from 0 to 8, if the above R 7 and R 8 Both are hydrogen atoms or R 7 and R 8 One of them is a hydrogen atom, and the other is a methyl group.

[0101] Chemical formula 3:

[0102] In the above chemical formula 3, B is x 1 is a halogen atom.

[0103] Chemical formula 4:

[0104] In the above chemical formula 4, X 2 is a halogen atom, R 6 It is a substituted or unsubstituted aryl group having 6 to 24 carbon atoms or an alkyl group having ...

Embodiment 1

[0129] Embodiment 1. The preparation of curing agent for epoxy resin

[0130] Step 1: Introduce 1450 g of toluene as an organic solvent, 306 g of a monomer (0.45 mol) represented by the following chemical formula 2-1, and 81.2 g of a monomer represented by the following chemical formula 2-1 into a reaction tank with a nitrogen input tube, a thermometer, and a circulating cooler attached to it. A monomer represented by 3-2 (0.4 mol), 168.68 g of a monomer represented by the following Chemical Formula 4-1 (1.2 mol).

[0131] Step 2: Under the condition of nitrogen input and temperature of 30°C, completely dissolve the monomers represented by the following chemical formula 2-1, chemical formula 3-2 and chemical formula 4-1 introduced in the above step 1, and 202.38g of triethyl After the amine (2 moles) was uniformly added dropwise for 2 hours, an aging process was performed for 2 hours. During the dropping and aging steps, the reaction temperature did not exceed 50°C.

[0132] ...

Embodiment 2

[0137] Embodiment 2. The preparation of curing agent for epoxy resin

[0138] Prepared in the same manner as in Example 1, 306g (0.45 mol), 97.45g (0.48 mol), and 146.19g (1.04 mol) of the compounds represented by the above chemical formula 2-1, chemical formula 3-2 and chemical formula 4-1 were dropped into respectively. Monomer, to obtain 440g of the weight average molecular weight (molecular weight) is the curing agent for epoxy resin of the following table 1 that is the brown solid of 7180.

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Abstract

The present invention relates to an epoxy hardener, and more particularly to the epoxy hardener, which has, by a hardener, high glass transition temperature, low moisture absorption strength, excellent adhesion, high peel strength and low thermal expansion coefficient, and has remarkably improved electrical properties, such as dielectric constant, and dielectric loss, etc., thereby being widely used in the electrical and electronic field.

Description

technical field [0001] The present invention relates to a curing agent for epoxy resin and a preparation method thereof, and more specifically relates to a curing agent for epoxy resin. The cured product based on the curing agent of the present invention has a high glass transition temperature, low moisture absorption, and excellent adhesion , high peel strength, low thermal expansion coefficient, and significantly improve electrical properties such as dielectric constant and dielectric loss. Background technique [0002] Recently, with the increase in capacity and ultra-high speed in the semiconductor industry, there has been a trend towards miniaturization through fusion of dissimilar metals and components. In this kind of fusion composite technology, the packaging technology that inserts different materials and parts into the device is the core. For this purpose, it is necessary to develop ) and heat-resistant core raw materials. [0003] In the next-generation integrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08L63/00C08G63/133
CPCC08G59/4276C08G63/133C08L63/00C08G59/18C08G59/628C08K5/105
Inventor 李垠龙李智爱郑榕洙李贵恒黄载锡白美贞郑源浩崔湖京
Owner SHIN A T&C CO LTD
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