Method for manufacturing high-frequency circuit board by using secondary lamination

Abstract

The invention discloses a method for manufacturing a high-frequency circuit board by using secondary lamination. The method comprises the followings steps: firstly manufacturing an FR4 board through primary lamination, measuring an expansion / contraction value of the FR4 board, and adjusting the expansion / contraction value of a high-frequency substrate during exposure according to the expansion / contraction value so as to guarantee counterpoint accuracy when the FR4 board is mixed and squeezed with the high-frequency substrate; moreover, before measuring the expansion / contraction value of the FR4 board, firstly drilling the FR4 board and adopting resin for hole plugging, simultaneously, before adjusting the expansion / contraction value of the high-frequency substrate, drilling the high-frequency substrate and adopting resin for hole plugging so as to prevent gumming of prepregs between the FR4 board and the high-frequency substrate during pressing and squeezing, guarantee the thickness uniformity of dielectric layers and further guarantee the yield of the high-frequency circuit board.

Description

technical field [0001] The present invention relates to the production field of high-frequency circuit boards, in particular to a method for producing high-frequency circuit boards by secondary lamination. Background technique [0002] Conventional high-frequency circuit boards are prepared by laminating high-frequency substrates with ordinary FR4 substrates to reduce costs; at present, in order to reduce production time, high-frequency circuits are prepared by laminating high-frequency substrates and ordinary FR4 substrates at one time version, but because the expansion and contraction values ​​of high-frequency substrates and ordinary FR4 substrates are different, it is difficult to control the expansion and contraction values ​​of the two parts during one-time lamination, resulting in product layer deviation and low yield. Contents of the invention [0003] The invention proposes a method for manufacturing high-frequency circuit boards by secondary lamination, which is ...

AI Technical Summary

Problems solved by technology

[0002] Conventional high-frequency circuit boards are prepared by laminating high-frequency substrates with ordinary FR4 substrates to reduce costs; at present, in order to reduce production time, high-frequency circuits are prepared by laminating high-frequency substrates and ordinary FR4 substrates at one time version, but because the expansion and contraction values ​​of high-frequency substrates and ordinary FR4 substrates are different, it is difficult to control the expansion and contraction values ​​of the two parts during one-time lamination, resulting in product layer deviation and low yield