Unlock instant, AI-driven research and patent intelligence for your innovation.

Preparation method of copper-clad laminate special for LED display screens

A technology of LED display screen and copper clad laminate, which is applied in the field of composite board, can solve the problems of high molecular weight of resin and poor bonding force between board layers, etc., and achieve the goal of reducing production cost, good heat dissipation, good electrical characteristics and chemical resistance Effect

Inactive Publication Date: 2018-04-24
浙江元集新材料有限公司
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The purpose of the present invention is to provide a high-temperature resistance and reduce production in order to solve the defects of bromine in the existing brominated epoxy glue formula, the resin molecular weight is large, and the bonding force between the boards is poor as the amount of filler increases. Cost, the produced copper clad laminate is printed into LED display PCB with good heat dissipation and the preparation method of special copper clad laminate for LED display

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A kind of preparation method of special copper-clad laminate for LED display, described preparation method comprises the following steps:

[0037] 1) Glue preparation: Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, inorganic filler, modified phenolic resin and formaldehyde scavenger; first dissolve dicyandiamide with dimethylformamide Stir with 2-methylimidazole, add epoxy resin, inorganic filler and modified phenolic resin for 6 hours to test the physical properties of the glue, and mature the glue for 4 hours before use;

[0038] 2) Add inorganic fillers to the glue prepared in step 1), then soak 1080 or 2116 glass cloth fiber cloth, bake in an oven at 170-200°C for 4-8 minutes to obtain a bonding sheet with a resin content of 50-70% ;

[0039] 3) Pressing and curing the bonding sheet obtained in step 2) and the copper foil to obtain a copper clad laminate.

[0040] The raw materials of the glue are in parts by weight: 60 parts of small mole...

Embodiment 2

[0042] A kind of preparation method of special copper-clad laminate for LED display, described preparation method comprises the following steps:

[0043] 1) Glue preparation: Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, inorganic filler, modified phenolic resin and formaldehyde scavenger; first dissolve dicyandiamide with dimethylformamide Stir with 2-methylimidazole, add epoxy resin, inorganic filler and modified phenolic resin for 6 hours to test the physical properties of the glue, and mature the glue for 4 hours before use;

[0044] 2) Add inorganic fillers to the glue prepared in step 1), then soak 2116 glass cloth fiber cloth, and bake in an oven at 180°C for 6 minutes to obtain a bonding sheet with a resin content of 60%;

[0045] 3) Pressing and curing the bonding sheet obtained in step 2) and the copper foil to obtain a copper clad laminate.

[0046] The raw materials of the glue are in parts by weight: 52 parts of small molecule epoxy resi...

Embodiment 3

[0048] A kind of preparation method of special copper-clad laminate for LED display, described preparation method comprises the following steps:

[0049] 1) Glue preparation: Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, inorganic filler, modified phenolic resin and formaldehyde scavenger; first dissolve dicyandiamide with dimethylformamide Stir with 2-methylimidazole, add epoxy resin, inorganic filler and modified phenolic resin for 6 hours to test the physical properties of the glue, and mature the glue for 4 hours before use;

[0050] 2) Add inorganic fillers to the glue prepared in step 1), then soak 1080 glass cloth fiber cloth, and bake in an oven at 170°C for 4 minutes to obtain a bonding sheet with a resin content of 50%;

[0051] 3) Pressing and curing the bonding sheet obtained in step 2) and the copper foil to obtain a copper clad laminate.

[0052] The raw materials of the glue are in parts by weight: 40 parts of small molecular epoxy res...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy equivalentaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
Login to View More

Abstract

The invention relates to a preparation method of a copper-clad laminate special for LED display screens. The preparation method comprises: preparing glue, impregnating glass fiber cloth in the glue, baking for 4-8 min to obtain a bonded sheet, and press-fitting the bonded sheet and a copper foil for curing to obtain the copper-clad laminate. Small-molecular epoxy resin and macromolecular epoxy resin are blended herein; prepreg made with the small-molecular epoxy resin has good mobility during press-fitting and can well impregnate glass fiber cloth, mass inorganic filling material can be addedin a glue formulation; prepreg produced according to the formulation provides good resin glue mobility during press-fitting and good impregnation for glass fiber; the copper-clad laminate produced isfree of weave grain exposure, the production cost can be reduced, and an LED display screen PCB (printed circuit board) printed with the produced copper-clad laminate has good heat-dissipating property.

Description

technical field [0001] The invention relates to the technical field of composite boards, in particular to a method for preparing a special copper-clad board for LED display screens with high temperature resistance and reduced production costs, and the produced copper-clad boards are printed into LED display screen PCBs and have good heat dissipation. Background technique [0002] As the development of electronic products tends to be multi-functional, the components of electronic products are also constantly developing in light, thin, short, small, etc., especially the wide application of high-density integrated circuit technology, which proposes high-performance, Requirements for high reliability and high security; requirements for good technical performance, low cost, and low energy consumption for industrial electronic products. Therefore, the core material of electronic products --- printed circuit board (Printed Circuit Board, referred to as PCB) base material CCL is fac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/14C08K3/22C08K3/28B32B37/10B32B38/00
CPCC08L63/00B32B37/10B32B38/00B32B2038/0076B32B2307/302B32B2307/306C08K2003/2296C08K2201/011C08L2201/08C08L2203/20C08L2205/025C08L2205/03C08L61/14C08K3/22C08K3/28
Inventor 章海燕陈刚龙天文谭永根张正旺
Owner 浙江元集新材料有限公司