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Electroless Nickel Bath

An electroless nickel plating and plating technology, applied in liquid electroless plating, coating, printed circuit manufacturing and other directions, can solve the problems of discoloration and insufficient corrosion resistance of circuit substrates, and achieve the goal of inhibiting nickel leakage plating and inhibiting pattern out-of-pocket. Effects of precipitation, corrosion resistance and good appearance

Active Publication Date: 2021-09-07
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when the electroless nickel plating solution of Patent Document 1 is used, the corrosion resistance of the circuit board is insufficient.
On the other hand, when using the electroless nickel plating solutions of Patent Document 2 and Patent Document 3, since metal components other than nickel such as copper added to the electroless nickel plating solution are precipitated in the electroless nickel plating film, changes in plating film characteristics such as discoloration may occur

Method used

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Examples

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Embodiment

[0055] Hereinafter, the present invention is described in more detail through the examples, but the present invention is not limited by the following examples, and can be implemented after appropriately changing within the scope of the content described in the context, and these are all included in the technical scope of the present invention Inside.

[0056] (Formation method of electroless nickel plating film)

[0057] First, a Uemura test pattern substrate manufactured by Uemura Kogyo Co., Ltd., in which a rolled copper foil having a thickness of 18 μm was laminated and patterned on a polyimide substrate was prepared. As the above-mentioned pattern substrate, there is a line and space pattern in which lines and spaces are alternately formed, a substrate with a line L of 20 μm and a space S of 20 μm (hereinafter referred to as substrate A), and a substrate with a line L of 40 μm and a space S of 20 μm (hereinafter Called substrate B). In addition, a line represents a patte...

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Abstract

The invention provides an electroless nickel plating bath, which can suppress missing nickel plating and precipitation outside the pattern, and can obtain an electroless nickel plating film with good corrosion resistance and appearance. The electroless nickel plating bath of the present invention is characterized in that the electroless nickel plating bath contains a reducing agent and a nitro-containing aromatic compound containing one or more nitro groups.

Description

technical field [0001] The invention relates to an electroless nickel plating bath for obtaining an electroless nickel plating film. Specifically, it relates to an electroless nickel plating bath for obtaining an electroless nickel plating film formed on a circuit board such as a flexible substrate used in electronic components such as a printed circuit board. Background technique [0002] In the past, when connecting circuit boards such as flexible boards and electronic components, it was possible to perform electroless nickel plating as a barrier metal on a pattern such as a copper pattern provided on the circuit board, followed by gold plating for the purpose of improving connection reliability. ENIG (Electroless Nickel Immersion Gold, Electroless Nickel Immersion Gold), or electroless nickel plating on the pattern as a barrier metal, electroless palladium plating on the nickel plating to form a film, and gold plating on it for the purpose of improving connection reliabil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/34
CPCC23C18/34H05K3/187
Inventor 桥本大督田边克久西村直志丸尾洋一
Owner C UYEMURA & CO LTD