Silicone adhesive compositions and tapes

A technology of silicone adhesives and compositions, applied in the direction of film/sheet adhesives, non-polymer adhesive additives, adhesives, etc., can solve insufficient curing, oxidized alkylene solvents and organic Solve problems such as poor compatibility of silicon adhesives, achieve the effect of favorable process and price, excellent antistatic performance, and less adhesive residue

Active Publication Date: 2021-04-02
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] The alkylene oxide solvent described in Patent Document 10 has poor compatibility with silicone adhesives, so there is a problem that the alkylene oxide solvent is released from the adhesive layer after the adhesive layer is cured. Separation, insufficient curing

Method used

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  • Silicone adhesive compositions and tapes
  • Silicone adhesive compositions and tapes
  • Silicone adhesive compositions and tapes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment I

[0401] [Embodiment 1: the first scheme]

[0402] Embodiment 1 is about the embodiments and comparative examples of the first scheme. Each component used in the following Examples and Comparative Examples is as follows. In the following, the viscosity is a value at 25° C. measured using a Brookfield rotational viscometer (BM type viscometer).

[0403] (A) Addition curing silicone

[0404] ・Polysiloxane (a1): Both ends of the molecular chain are covered with dimethylvinylsilyl (SiMe 2 Vi group) end-capped vinyl-containing polydimethylsiloxane has a viscosity of 27000mPa·s in 30% toluene solution, and has a vinyl content of 0.075 mol%.

[0405] ・Polysiloxane (a2): Both ends of the molecular chain are covered with dimethylvinylsilyl (SiMe 2 Vi group) end-capped vinyl-containing polydimethylsiloxane has a viscosity of 27000mPa·s in 30% toluene solution, and has a vinyl content of 0.15 mol%.

[0406] ・Silicone (b): by Me 3 SiO 0.5 Cell and SiO 2 Units of polysiloxane (Me 3 ...

Embodiment 1

[0462] Use polyoxyalkylene compound (m=2, n=0) and ionic liquid A in embodiment 1 (I)~4 (I) and comparative example 1 (I) and 2 (I), changed polyoxyalkylene Amount of alkyl compound added. The results are shown in the following Table 1 (I) (the symbol (I) is omitted in the following table).

[0463]

[0464] Silicone Adhesive Composition I-α

Embodiment 5

[0465] Use polyoxyalkylene compound (m=8, n=0) and ionic liquid A in embodiment 5 (I)~8 (I) and comparative example 3 (I) and 4 (I), changed polyoxyalkylene Amount of alkyl compound added. The results are shown in the following Table 2 (I) (the symbol (I) is omitted in the following table).

[0466]

[0467] Silicone Adhesive Composition I-α

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Abstract

The first object of the present invention is to provide a silicone adhesive that provides an adhesive layer with excellent antistatic properties and excellent adhesion to substrates. After the adhesive tape or the adhesive film is peeled from the adherend, there is little adhesive residue on the adherend. The second object of the present invention is to provide a silicone adhesive composition which can be well cured by heating for a short time, especially less than 5 minutes, to obtain an adhesive layer with excellent antistatic properties. The first invention of the present invention provides a silicone adhesive composition, which is an addition reaction-curable silicone adhesive composition, characterized in that it contains: (A) an addition-curable silicone, (B) in 1 A compound having at least 2 unsaturated hydrocarbon groups and 2 (poly)oxyalkylene residues in the molecule, and (C) a lithium-free ionic liquid. The second aspect of the present invention provides a silicone adhesive composition, which is an addition reaction-curable silicone adhesive composition, characterized in that it contains: (A) addition-curable silicone, (B) in 1 molecule A compound having at least one unsaturated hydrocarbon group and having at least one (poly)oxyalkylene residue, (c) an ionic liquid that does not contain lithium, and (e) a complex that is not a compound having an unsaturated hydrocarbon bond Platinum group metal catalysts.

Description

technical field [0001] The present invention relates to silicone adhesive compositions and adhesive tapes. Specifically, it relates to a silicone adhesive composition having excellent antistatic properties and an adhesive tape using the same. Background technique [0002] In recent years, electronic instruments have become thinner, lighter and smaller. Along with this, electronic components mounted in electronic instruments have also become smaller. Silicone tapes are widely used as process tapes because of their high heat resistance, or as process transfer tapes because of their good re-peelability. [0003] However, since silicone adhesives have high electrical insulating properties, when thin and small electronic parts are peeled off, peeling electrification is caused, and in the worst case, dielectric breakdown of the electronic parts may be caused. Therefore, in order to prevent peeling electrification, it is necessary to develop an antistatic silicone adhesive. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J7/30C09J11/06C09J183/05C09J183/07C09J7/20
CPCC09J11/06C09J7/20C08G77/12C08G77/20C09J183/04C08L83/00C08L71/00C08K5/56
Inventor 黑田泰嘉
Owner SHIN ETSU CHEM CO LTD
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