A method for retesting a wafer

Abstract

The invention provides a retest method of a wafer. The retest method is applied to a manufacturing execution system and comprises the following steps of sending a test result formed by test to a waferreceiving test unit after test is executed on the wafer by wafer test equipment; sending the test result to a counting processing control system by the water test unit; processing the test result bythe counting processing control system according to a preset control rule to form a corresponding trigger instruction; sending the trigger instruction to the manufacturing execution system by the counting processing control system; selecting a corresponding processing class by the manufacturing execution system according to the trigger instruction, and outputting a retest item corresponding to theprocessing class to the water test equipment; and executing retest on a wafer to be tested by the wafer test equipment according to the retest item. The reset method has the beneficial effect that manual interference is effectively reduced, and wafer scrap caused by manual judgment by mistake and yield waste of the wafer test equipment are further prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to a wafer retesting method. Background technique [0002] Such as figure 1 As shown, when the existing wafer test equipment 1 performs an electrical test on the wafer, the test result formed by the test is sent to the statistical process control system 4 through the wafer receiving test unit 2, and the statistical process control system 4 compares the test results Perform analysis to send the analysis results to the manufacturing execution system 5, select and activate the out-of-control action planning unit through the manufacturing execution system 5, after the out-of-control action planning unit is triggered, the client 6 grabs the test result data through the analysis and processing data tool 3 to judge Wafer parameters that do not pass the test are searched for corresponding operating procedures to finally determine the retest plan that the wafer testing equipme...

AI Technical Summary

Problems solved by technology

Among them, it takes a lot of time (about 2 hours) to determine the retest in the out-of-control action plan unit, and the efficiency is extremely low; and the subsequent retest is greatly affected by human factors due to the participation of people in the judgment, and the wrong test item is sometimes selected. Occurs, resulting in the scrapping of wafer products due to test failures and waste of wafer testing equipment capacity

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