LED packaging method and structure

A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting heat dissipation effect, small heat capacity of metal heat dissipation substrate, and easy deformation, so as to increase heat dissipation effect, improve luminous dispersion, reduce cost effect

Inactive Publication Date: 2018-04-27
XIAN CREATION KEJI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. At present, most of the chips are packaged on a thin metal heat dissipation substrate. Because the metal heat dissipation substrate is thin, the heat capacity is small, and it is easy to deform, the contact between it and the bottom surface of the heat sink is not close enough to affect the heat dissipation effect.
[0006] 2. Since the light emitt

Method used

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  • LED packaging method and structure
  • LED packaging method and structure
  • LED packaging method and structure

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0045] Example one

[0046] See figure 1 , figure 1 It is a schematic flow diagram of an LED packaging method provided by an embodiment of the present invention, including:

[0047] Step 1. Select the heat dissipation substrate;

[0048] Step 2: soldering the LED chip to the heat dissipation substrate;

[0049] Step 3: Coating a first silica gel on the LED chip to form a first silica gel layer;

[0050] Step 4: Prepare a hemispherical lens area on the first silica gel layer;

[0051] Step 5. Coating a second silica gel on the first silica gel layer and the hemispherical lens area to form a second silica gel layer.

[0052] Wherein, the heat dissipation substrate is a copper material heat dissipation substrate.

[0053] Specifically, the refractive index of the silica gel in the first silica gel layer, the second silica gel layer, and the hemispherical lens area increase sequentially.

[0054] Specifically, see figure 2 , figure 2 It is a schematic diagram of a heat dissipation substrate o...

Example Embodiment

[0071] Example two

[0072] Please refer to image 3 , image 3 It is a flowchart of an LED packaging method provided by another embodiment of the present invention. Based on the above-mentioned embodiments, this embodiment will describe the LED packaging method of the present invention in detail as follows. Specifically, it includes the following steps:

[0073] S21. Select a heat dissipation substrate;

[0074] S22. Select LED chips;

[0075] S23. Soldering the LED chip to the heat dissipation substrate;

[0076] S24. Coating a first silica gel on the LED chip to form a first silica gel layer;

[0077] S25, preparing a hemispherical lens area above the first silica gel layer;

[0078] S26. Configure phosphor glue;

[0079] S27, coating phosphor glue on the first silica gel layer and the hemispherical lens area to form a second silica gel layer; to complete the LED packaging.

[0080] Specifically, step S21 may include:

[0081] S211. Select a heat dissipation substrate and bracket;

[0082...

Example Embodiment

[0115] Example three

[0116] Further, please refer to Image 6 , Image 6 It is a schematic diagram of an LED package structure provided by yet another embodiment of the present invention. The LED package structure provided in this embodiment is prepared by the method provided in the foregoing embodiment. Specifically, the LED packaging structure includes: an LED heat dissipation substrate 31, a first silica gel layer 32, a hemispherical lens area 33, and a second silica gel layer 34 in order from bottom to top.

[0117] Wherein, the LED heat dissipation substrate 31 includes a heat dissipation substrate and an LED chip arranged on the heat dissipation substrate.

[0118] Specifically, the first silica gel layer 32 is silica gel without phosphors, and the second silica gel layer is silica gel with phosphors.

[0119] Further, the hemispherical lens area 33 includes a plurality of uniformly distributed silica gel hemispheres in a rectangular or rhombic shape. The silica gel in the sil...

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Abstract

The invention relates to an LED packaging method and an LED packaging structure. The LED packaging method comprises the steps of: step 1, selecting a heat-dissipating substrate; step 2, welding an LEDchip to the heat-dissipating substrate; step 3, coating a first silica gel layer on the LED chip; step 4, preparing a hemispherical lens region on the first silica gel layer; step 5, and coating a fluorescent powder adhesive on the first silica gel layer and in a hemispherical cavity region to form a second silica gel layer. The LED packaging method and the LED packaging structure provided by theinvention adopt the structures of the first silica gel layer, the hemispherical lens region and the second silica gel layer; a lens is formed in the silica gel by utilizing the features of differenttypes of silica gel in the structures of the first silica gel layer, the hemispherical lens region and the second silica gel layer and different refractive indexes of the fluorescent powder adhesive,thus the problem of scattered light emission of the LED chip is improved, and the light emitted by means of a light source can be more concentrated; meanwhile, the refractive indexes of the first silica gel layer, the second silica gel layer and the hemispherical lens region are increased in sequence, thereby ensuring that the LED chip can illuminate more through packaging materials.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to an LED packaging method and structure. Background technique [0002] At the end of the last century, the breakthrough of III-V compound semiconductors represented by GaN-based materials in the field of blue light chips brought about a revolution in lighting. The symbol of this revolution is the high-power light-emitting diode (Light-Emitting Diode, LED) Semiconductor lighting technology (Solid State Lighting, SSL) as the light source. [0003] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Under the background of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21st century. This is...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/54H01L33/56H01L33/58H01L33/64
CPCH01L33/0075H01L33/48H01L33/504H01L33/54H01L33/56H01L33/58H01L33/641
Inventor 张亮
Owner XIAN CREATION KEJI CO LTD
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