LED packaging method and structure

Abstract

The invention relates to an LED packaging method and an LED packaging structure. The LED packaging method comprises the steps of: step 1, selecting a heat-dissipating substrate; step 2, welding an LEDchip to the heat-dissipating substrate; step 3, coating a first silica gel layer on the LED chip; step 4, preparing a hemispherical lens region on the first silica gel layer; step 5, and coating a fluorescent powder adhesive on the first silica gel layer and in a hemispherical cavity region to form a second silica gel layer. The LED packaging method and the LED packaging structure provided by theinvention adopt the structures of the first silica gel layer, the hemispherical lens region and the second silica gel layer; a lens is formed in the silica gel by utilizing the features of differenttypes of silica gel in the structures of the first silica gel layer, the hemispherical lens region and the second silica gel layer and different refractive indexes of the fluorescent powder adhesive,thus the problem of scattered light emission of the LED chip is improved, and the light emitted by means of a light source can be more concentrated; meanwhile, the refractive indexes of the first silica gel layer, the second silica gel layer and the hemispherical lens region are increased in sequence, thereby ensuring that the LED chip can illuminate more through packaging materials.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to an LED packaging method and structure. Background technique [0002] At the end of the last century, the breakthrough of III-V compound semiconductors represented by GaN-based materials in the field of blue light chips brought about a revolution in lighting. The symbol of this revolution is the high-power light-emitting diode (Light-Emitting Diode, LED) Semiconductor lighting technology (Solid State Lighting, SSL) as the light source. [0003] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Under the background of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21st century. This is...

AI Technical Summary

Problems solved by technology

[0005] 1. At present, most of the chips are packaged on a thin metal heat dissipation substrate. Because the metal heat dissipation substrate is thin, the heat capacity is small, and it is easy to deform, the contact between it and the bottom surface of the heat sink is not close enough to affect the heat dissipation effect.

[0006] 2. Since the light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, this causes the illumination brightness of the light source to be insufficiently concentrated, and generally requires secondary shaping through an external lens to meet the lighting needs of specific occasions, which increases production costs.

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