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Liquid epoxy resin composition

A liquid epoxy resin, epoxy resin technology, applied in the direction of epoxy resin glue, adhesive type, adhesive, etc., can solve the problems of high water absorption, poor moisture resistance reliability, etc., to achieve no damage to reliability and adhesion. excellent effect

Inactive Publication Date: 2018-05-01
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cured product containing cyanate resin and bismaleimide compound has a high water absorption rate, the moisture resistance reliability is deteriorated

Method used

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  • Liquid epoxy resin composition
  • Liquid epoxy resin composition
  • Liquid epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0083] Method for preparing the composition

[0084] The liquid epoxy resin composition of the present invention can be prepared, for example, by the method shown below.

[0085]For example, the (A) component epoxy resin, (B) component imidazole-based curing accelerator, and (C) component maleimide compound are heat-treated, while simultaneously or separately mixing and stirring, and further dissolving and / or disperse to obtain a mixture of (A) component, (B) component and (C) component. It is also possible to add and mix at least one of the other additives of the (D) component of the inorganic filler, mold release agent, flame retardant, and ion trapping agent to the (A) component, (B) component, and (C) component. in the mixture of ingredients. Each component of (A) component - (D) component may be used individually by 1 type, and may use 2 or more types together.

[0086] The preparation method of the composition and the equipment for mixing, stirring and dispersing are ...

Embodiment

[0088] The composition shown in Table 1 was mixed with a planetary mixer at 25° C. and the components shown below were mixed, and then kneaded and mixed using a three-roll mill to prepare a liquid epoxy resin composition.

[0089] In addition, in Table 1, the quantity is shown as a mass part. The molecular weight is the weight average molecular weight (Mw) measured by GPC.

[0090] The prepared compositions were evaluated by the following evaluation methods. The results are shown in Table 1.

[0091] About Examples 1-11 and Comparative Examples 1-7, the composition shown in Table 1 mix|blended each component shown below, and prepared the liquid epoxy resin composition. This liquid epoxy resin composition was further molded under the conditions of 100° C.×2 hours and 150° C.×4 hours to obtain respective cured products.

[0092] (A) epoxy resin

[0093] (1) Epoxy resin (A1): bisphenol A type epoxy resin (YD-8125: manufactured by Tohto Chemical Co., Ltd.)

[0094] (2) Epoxy ...

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Abstract

The invention provides a liquid epoxy resin composition. Provided is a liquid epoxy resin composition that is superior in workability and adhesion to a base material, and exhibits an unimpaired resinreliability even under a high-temperature and high-humidity environment. The liquid epoxy resin composition contains (A) an epoxy resin; (B) an imidazole-based curing accelerator; and (C) a maleimidecompound. The weight-average molecular weight (Mw) of the maleimide compound (C) is 500 to 2,000, and a maleimide group equivalent per 1 mol of the maleimide compound (C) is 250 to 1,000 g / eq.

Description

technical field [0001] The present invention relates to liquid epoxy resin compositions containing maleimide compounds. Background technique [0002] In recent years, the miniaturization of electronic devices such as mobile phones and smartphones, ultra-thin liquid crystal and plasma TVs, and lightweight notebook computers has been advancing. Electronic components used in these electronic devices are being integrated at a high density and further packaged at a high density. In addition, among the resin materials used for these electronic components, resin materials with low expansion force are sought for in relation to the time of manufacture and use. In addition, since high-integration electronic products generate heat, heat resistance is also sought after among resin materials. [0003] Epoxy resins widely used for electronic parts have the characteristics of high heat resistance and high adhesion to substrates, but they also have the disadvantage of being hard and britt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C09J163/00
CPCC08G59/506C09J163/00C08K5/3415C08L63/00C08G59/1477C08G59/5073C08K5/3445C08G59/686C08G59/245C08G59/4042
Inventor 串原直行隅田和昌
Owner SHIN ETSU CHEM IND CO LTD
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