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Wooden plate processing adhesive

A technology of adhesive and wood board, which is applied in the field of wood board manufacturing, can solve the problems of board fragmentation or dispersion, unsatisfactory adhesive effect, etc., and achieve the effect of strong adhesive ability

Inactive Publication Date: 2018-05-08
定远县嘉恒木业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The wood board manufacturing process is usually to crush the raw materials and then extrude them to form new boards. During the extrusion process, some adhesives need to be added to make the formed boards not easy to damage. The effect of the commonly used adhesives is not ideal at present. boards are prone to chipping or dispersing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A wood board processing adhesive, which consists of the following raw materials in parts by weight: 100 parts of epoxy resin, 100 parts of paraffin emulsion, 1 part of borax, 1 part of caustic soda, 10 parts of magnesium oxide, 15 parts of starch, α-cyano 15 parts of ethyl acrylate, 9 parts of talc, 22 parts of acetone, 5 parts of propanol, 4 parts of paraffin and 2 parts of ethylene-vinyl acetate copolymer.

Embodiment 2

[0014] A wood board processing adhesive, which consists of the following raw materials in parts by weight: 500 parts of epoxy resin, 200 parts of paraffin emulsion, 5 parts of borax, 3 parts of caustic soda, 20 parts of magnesium oxide, 25 parts of starch, α-cyano 20 parts of ethyl acrylate, 11 parts of talc, 26 parts of acetone, 7 parts of propanol, 6 parts of paraffin and 8 parts of ethylene-vinyl acetate copolymer.

Embodiment 3

[0016] A wood board processing adhesive, which consists of the following raw materials in parts by weight: 300 parts of epoxy resin, 150 parts of paraffin emulsion, 3 parts of borax, 2 parts of caustic soda, 15 parts of magnesium oxide, 20 parts of starch, α-cyano 18 parts of ethyl acrylate, 10 parts of talc, 24 parts of acetone, 6 parts of propanol, 5 parts of paraffin and 5 parts of ethylene-vinyl acetate copolymer.

[0017] The high-strength sawdust adhesive of the invention has strong bonding ability, is suitable for the manufacturing process of wood chips bonded into wood boards, and not only fills the gaps between the saw chips, but also plays the role of bonding.

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PUM

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Abstract

The invention discloses a wooden plate processing adhesive. The wooden plate processing adhesive is prepared from, by weight, 100-500 parts of epoxy resin, 100-200 parts of paraffin emulsified liquid,1-5 parts of borax, 1-3 parts of caustic soda flakes, 10-20 parts of magnesium oxide, 15-25 parts of starch, 15-20 parts of alpha-cyanoacrylate, 9-11 parts of talcum powder, 22-26 parts of acetone, 5-7 parts of propyl alcohol, 4-6 parts of paraffin and 2-8 parts of ethylene-vinyl acetate copolymers. The high-strength wood dust adhesive has a very high adhering capability, is applicable to the manufacturing process of a wood dust adhering wooden plate and not only fills but also adheres to gaps of wood dust.

Description

technical field [0001] The invention relates to the field of wood board manufacturing, in particular to a wood board processing adhesive. Background technique [0002] The wood board manufacturing process is usually to crush the raw materials and then extrude them to form new boards. During the extrusion process, some adhesives need to be added to make the formed boards not easy to damage. The effect of the commonly used adhesives is not ideal at present. slabs are prone to chipping or dispersing. Contents of the invention [0003] The object of the present invention is to provide a kind of wood board processing adhesive, solve above-mentioned technical defect. [0004] To achieve the above object, the present invention provides the following technical solutions: [0005] A wood board processing adhesive, which is composed of the following raw materials in parts by weight: 100-500 parts of epoxy resin, 100-200 parts of paraffin emulsion, 1-5 parts of borax, 1-3 parts of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/04C09J11/04C09J11/08C09J11/06
CPCC09J4/06C09J11/04C09J11/06C09J11/08
Inventor 朱文华
Owner 定远县嘉恒木业有限公司
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