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Flexible epoxy resin adhesive capable of being cured under room temperature

A flexible epoxy resin and room temperature curing technology, which is applied in the field of epoxy resin adhesives and room temperature curing flexible epoxy resin adhesives, can solve the problems of poor flexibility, easy cracking during use, poor peel strength and impact resistance, etc., to achieve Improved impact resistance, good adhesion, good flexibility and adhesion

Inactive Publication Date: 2018-05-08
上海美东生物材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of room temperature curable flexible epoxy resin adhesive, described this kind of room temperature curable flexible epoxy resin adhesive will solve the poor flexibility of epoxy resin in the prior art, peel strength and impact resistance, use Technical problems prone to cracking during the process

Method used

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  • Flexible epoxy resin adhesive capable of being cured under room temperature
  • Flexible epoxy resin adhesive capable of being cured under room temperature
  • Flexible epoxy resin adhesive capable of being cured under room temperature

Examples

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Embodiment 1

[0023] Component A: 100g epoxy resin, 10g polyvinyl butyral, 5g cardanol glycidyl ether, 5g phthalate, 20g filler. Component B: 100 grams of polyamide 650, 3 grams of KH560, 3 grams of DMP-30.

[0024] In the preparation process of the present invention, each raw material is firstly weighed according to parts by weight, and then put into a container and mixed uniformly for use. The shearing strength of this embodiment can reach 30MPa, and the peeling strength is above 42MPa.

Embodiment 2

[0026] Component A: 100g epoxy resin, 15g polyvinyl butyral, 3g cardanol glycidyl ether, 8g phthalate, 15g filler. Component B: 100 grams of polyamide 650, 3 grams of KH560, 3 grams of DMP-30.

[0027] In the preparation process of the present invention, each raw material is firstly weighed according to parts by weight, and then put into a container and mixed uniformly for use. The shearing strength of this embodiment can reach 32MPa, and the peeling strength is above 45MPa.

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Abstract

The invention provides a flexible epoxy resin adhesive capable of being cured under room temperature. The flexible epoxy resin adhesive is prepared from a component A and a component B, wherein the component A is prepared from the following raw materials in parts by weight: 100 parts of macromolecular flexible epoxy resin, 5-50 parts of polyvinyl butyral, 3-20 parts of cardanol glycidyl ether, 1-20 parts of phthalate and 10-40 parts of a filler. The component B is prepared from the following raw materials in parts by weight: 100 parts of polyamide 650, 1-5 parts of KH560 and 1-5 parts of DMP-30. Through adoption of flexibility and adhesion of polyvinyl butyral resin, the adhesive has higher flexibility and adhesion; polyhydroxyl and long carbon chains of macromolecular novel epoxy resin are mainly used, so that the shearing strength of the flexible epoxy resin adhesive can reach up to 20MPa, and the peel strength of the flexible epoxy resin adhesive can reach 40MPa or more.

Description

Technical field: [0001] The invention belongs to the field of chemical industry and relates to an epoxy resin adhesive, in particular to a room temperature curing flexible epoxy resin adhesive. Background technique: [0002] Epoxy resin has excellent mechanical and adhesive properties, and has been widely used in the field of adhesives. Due to the disadvantages of poor flexibility of epoxy resin, its peel strength and impact resistance are poor. During use, due to mechanical stress or temperature changes Cracking is prone to occur. Invention content: [0003] The object of the present invention is to provide a kind of room temperature curable flexible epoxy resin adhesive, described this kind of room temperature curable flexible epoxy resin adhesive will solve the poor flexibility of epoxy resin in the prior art, peel strength and impact resistance, use A technical problem that is prone to cracking during the process. [0004] The present invention provides a room temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J129/14C09J11/06C08G59/44
CPCC09J163/00C08G59/44C09J11/06C08L29/14C08K5/12C08K5/5435
Inventor 毕丽杰
Owner 上海美东生物材料股份有限公司
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