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Transparent and invisible RFID label material and preparation method

An RFID tag and invisible technology, applied in the field of RFID, can solve the problems of weak anti-bending ability, easy damage, loss of product authenticity and uniqueness of RFID tags, etc., achieve good anti-theft and anti-counterfeiting functions, reduce surface resistance, and have a wide range of applications Effect

Active Publication Date: 2018-05-11
惠州清水湾生物材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Conventional RFID tags have the function of RFID management and identification, but because the RFID tags currently on the market are usually made of copper foil and aluminum foil, they are opaque, and criminals can use many methods to remove them, such as tearing off a corner of the label, using In the form of hot air blowing or other methods, the label is completely removed and transferred to other items, thereby losing the authenticity and uniqueness of the product, and the conventional RFID label has weak bending resistance and is easy to damage

Method used

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  • Transparent and invisible RFID label material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of preparation of transparent invisible RFID tag material:

[0024] S1, take a PET film with a thickness of 0.01mm as the matrix film, lay it flat on the coating platform, and coat 0.1% nano-silver wire conductive silver paste on the matrix layer through a coating machine, the length and diameter of the nano-silver wire The ratio is 1000, the coating thickness is 30 μm, and the nano-silver wire conductive silver paste is cured at room temperature to obtain a conductive layer;

[0025] S2, preparation of conductive layer pattern: the conductive layer prepared in step S1 forms a conductive pattern by screen printing;

[0026] S3, preparation of the adhesive layer: the surface of the conductive layer prepared in step S2 is further coated with a UV-curable pressure-sensitive adhesive on the conductive layer, the coating thickness is 5 μm, and the thickness is 2 J / cm under the irradiation of a UV lamp. 2 The energy curing, that is, transparent invisible RFID label ma...

Embodiment 2

[0028] Preparation of a transparent invisible RFID label material:

[0029] S1, take a PE film with a thickness of 0.2mm as the matrix film, lay it flat on the coating platform, and coat 0.2% nano-silver wire and nano-silver particle conductive silver paste on the matrix layer through a coating machine, the nano-silver wire The ratio of length to diameter is 700, the coating thickness is 40 μm, and the conductive silver paste of nano-silver wire is cured at room temperature to obtain a conductive layer;

[0030] S2, preparation of conductive layer pattern: the conductive layer prepared in step S1 is mechanically embossed to form a conductive pattern;

[0031] S3, preparation of the adhesive layer: the surface of the conductive layer prepared in step S2 is further coated with a hot-melt adhesive on the conductive layer to a thickness of 8 μm, and cured at room temperature for 3 hours to obtain a transparent invisible RFID label material.

Embodiment 3

[0033] A kind of preparation of transparent invisible RFID tag material:

[0034] S1, take a PVC film with a thickness of 0.3mm as the matrix film, lay it flat on the coating platform, and coat 0.3% nano-silver wire conductive silver paste on the matrix layer through a coating machine, the length and diameter of the nano-silver wire The ratio is 500, the coating thickness is 50 μm, and the nano-silver wire conductive silver paste is cured at room temperature to obtain a conductive layer;

[0035] S2, preparation of conductive layer pattern: the conductive layer prepared in step S1 is mechanically embossed to form a conductive pattern;

[0036] S3, preparation of the adhesive layer: the surface of the conductive layer prepared in step S2 is further coated with a solvent-based resin adhesive on the conductive layer to a thickness of 10 μm, and cured at room temperature for 3 hours to obtain a transparent invisible RFID label material.

[0037] The production of conductive lines...

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Abstract

The present invention discloses a transparent and invisible RFID label material and a preparation method. The transparent and invisible RFID label material comprises a matrix layer, a conductive layerand an adhesive layer orderly from top to bottom, the light transmittance of the matrix layer is greater than 95%, the thickness of the conductive layer is between 10 micrometers and 50 micrometers,the surface resistivity is less than 30 Ohm and the transparency is greater than 90%, and the thickness of the adhesive layer is between 1 micrometer and 10 micrometers. The preparation method of thetransparent and invisible RFID label material is characterized by firstly laying the matrix layer on a coating platform flatly, coating the silver nanowire conductive silver paste on the matrix layervia a coating mechanism, curing the silver nanowire conductive silver paste and then forming the conductive layer, forming the conductive layer into a conductive pattern via the silk-screen printing or the mechanical embossing, and finally, further coating an adhesive on the conductive layer, and curing to obtain the transparent and invisible RFID label material. The present invention provides thetransparent and invisible RFID label material which is high in transparency, good in flexibility and bending resistance and very low in surface resistance, and has the very good antitheft and anti-fake functions and the preparation method thereof.

Description

technical field [0001] The invention relates to the field of RFID technology, in particular to a transparent invisible RFID label material and a preparation method. Background technique [0002] Conventional RFID tags have the function of RFID management and identification, but because the RFID tags currently on the market are usually made of copper foil and aluminum foil, they are opaque, and criminals can use many methods to remove them, such as tearing off a corner of the label, using In the form of hot air blowing or other methods, the label is completely removed and transferred to other items, thereby losing the authenticity and uniqueness of the product, and the conventional RFID label has weak bending resistance and is easily damaged. [0003] Therefore, it is an urgent technical problem to develop an RFID label material that is transparent, flexible, extremely low surface resistance, strong in bending resistance, and has good anti-theft and anti-counterfeiting functi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/07722
Inventor 曹文彬温维佳曾西平
Owner 惠州清水湾生物材料有限公司
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