Cooling structure scheme for solving blocking problem of heat conduction passage of heat generation component
A heating element and heat dissipation structure technology, applied in the field of inertial navigation system, can solve the problems of heating element operating temperature rise, device damage, thermal resistance increase, etc., to reduce operating temperature, ensure accuracy and service life, and reduce machining costs Effect
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[0021] The embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the embodiments are illustrative, not restrictive, and cannot limit the protection scope of the present invention.
[0022] A heat dissipation structure scheme for solving the problem of blocking heat conduction channels of heating elements, including a heating element mounting substrate 1 , a heat conducting plate 2 , a heating element 3 and a radiator 4 . The heating element mounting substrate is a metal or non-metallic substrate, the heating element and the heat conducting plate are installed on the heating element mounting substrate, and the heat conducting plate is located outside the heating element. The thermal conductivity of the material of the heat conduction plate is required to be large, and the heat conduction plate itself has good thermal conductivity; the heat conduction plate is preferably an integral structure,...
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Abstract
Description
Claims
Application Information
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