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The method of pre-adjusting the size of metal wire

A metal wire, metal wire technology, used in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as manpower and material resources

Active Publication Date: 2020-03-20
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the methods commonly used in the industry to regulate the size of metal wires in the copper interconnection process are as follows: figure 1 Shown: first adjust the width of the etched groove by adjusting the width of the photolithographic groove to achieve the purpose of adjusting the size of the copper wire; then adjust the content of the reaction by-products by adjusting the ratio of C / F gas during the etching process The size of the groove width after etching can achieve the purpose of adjusting the size of the copper wire, but the confirmation of the key dimensions of this method needs to be adjusted after the etching is completed.
Since the photolithography size and dry etching size will eventually have deviations, this method consumes a lot of manpower and material resources

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Embodiment Construction

[0028] In the semiconductor manufacturing process, the final determination of the metal wire size of the copper interconnection process in the later stage is the stable plasma and plasma formed by the photolithography patterned wafer in a high vacuum environment, and the reactive etching gas is excited by the radio frequency electric field. The area of ​​the wafer surface not covered by the mask undergoes a specific reaction, and the required size is finally obtained. The present invention proposes: by calculating the length of the metal copper wire per unit area, determining the etching dimension difference (CD bias), adjusting the key lithography dimension in advance, and obtaining the required key dimension after etching to achieve the pre-regulated copper wire dimension the goal of.

[0029] The method for pre-adjusting the size of a metal wire of the present invention includes the following steps:

[0030] Step 1: Predict the key dimension difference of etching in advance. T...

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Abstract

The invention discloses a method for pre-adjusting the metal wire size. The length of the metal copper wires in the unit area of the corresponding layout before etching, and then the size difference (CD bias) after etching is determined, and the front-layer photoetching key size (CD) is adjusted in advance so as to obtain the key size after the required etching, namely the metal wire size. The metal wire size is predicted in advance, so that the cost is greatly saved.

Description

Technical field [0001] The invention relates to a method for semiconductor integrated circuits, in particular to a method for pre-adjusting the size of metal wires. Background technique [0002] Copper interconnection technology refers to a new type of semiconductor manufacturing technology that uses copper metal materials to replace traditional aluminum metal interconnection materials in the production of semiconductor integrated circuit interconnection layers. Since the use of copper interconnects can reduce the thickness of the interconnection layer, the distributed capacitance between the interconnection layers is reduced, thereby making it possible to increase the frequency. In addition, when the device density is further increased, there will be reliability problems caused by electron migration, and copper has a strong advantage over aluminum in this respect. Copper interconnection technology is mainly used to prepare microprocessors, high-performance memories, digital sig...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L21/027
CPCH01L21/027H01L24/44
Inventor 黄达斐昂开渠
Owner SHANGHAI HUALI MICROELECTRONICS CORP