Laser processing drilling method of workpiece with complex cavity and auxiliary filling system

A laser processing and filling system technology, applied in the field of auxiliary systems, can solve problems such as surface wall damage, and achieve the effect of dense filling, simple structure and low cost

Pending Publication Date: 2018-05-18
XIAN MICROMACH TECH CO LTD
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Problems solved by technology

[0005] The object of the present invention is to provide a laser machining hole-making method and an auxiliary filling system for a workpiece with a complex cavity structure, through the method of gas-solid two-phase flow supplemented by vibration, the powder particles in the complex cavity can be densely filled without dead ends, and the problem is solved. The problem of damage to the surface wall when processing gas film holes with laser

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  • Laser processing drilling method of workpiece with complex cavity and auxiliary filling system
  • Laser processing drilling method of workpiece with complex cavity and auxiliary filling system

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Embodiment Construction

[0035] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0036] The present invention proposes a method of using laser to process through-holes and through-groove features in hollow blades and other workpieces with complex cavities, so as to realize dense filling of powder particles without dead ends to prevent damage to the opposite wall of the workpiece processing part during laser processing. .

[0037] In this method, before starting laser processing and hole making, air flow is used to blow particles into the cavity of the workpiece to be processed while vibrating the workpiece to achieve the effect of densely filling the particles in the cavity. After the filling is completed, the laser processing and hole making process is carried out. After the hole is processed, the inner cavity of the workpiece is cleaned with high-pressure airflow from multiple angles, and the workpiece is vibrated at the ...

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Abstract

The invention relates to a laser processing drilling method, in particular to a laser processing drilling method of a workpiece with a complex cavity and an auxiliary filling system. The laser processing drilling method of the workpiece with the complex cavity comprises the following steps of firstly, by adopting gas as a carrier of powder particles, after uniformly mixing the powder particles andthe gas, blowing a mixture into a workpiece cavity which is to be filled and has a complex cavity; controlling the workpiece cavity to be filled to vibrate in the blowing process, and ensuring the powder particles to be densely filled in an inner cavity of the workpiece to be filled; then performing laser processing drilling on the filled workpiece; adopting a high-pressure air flow to clean theinner cavity of the workpiece to be cleaned at multiple angles for a part which is processed in the step two; and in the cleaning process, controlling the workpiece to be cleaned to vibrate at the same time. By adopting the laser processing drilling method and the auxiliary filling system, the problem that a wall opposite to film holes is easily damaged when the film holes are processed by utilizing laser light is solved.

Description

technical field [0001] The present invention relates to a method of laser machining hole making, in particular to a method for machining through holes and grooves of workpieces with complex cavity structures by laser, in particular to a method for complex cavities of small and medium-sized workpieces such as fuel injectors and blades. The method of carrying out the processing and the auxiliary systems involved. Background technique [0002] Laser, especially ultra-fast laser drilling technology is the latest technology for micro-hole machining of hollow blades and other workpieces. However, due to the complex structure and small size of hollow blades and other cavities, it is inevitable that the laser beam will Damage to the opposite wall of the hole made, this technical bottleneck has caused the development of laser technology to process microholes on workpieces with complex cavities to lag behind. At present, there are no mature technical means at home and abroad to break ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/70B23K26/144
CPCB23K26/144B23K26/382B23K26/702
Inventor 贺斌赵卫田东坡李朋
Owner XIAN MICROMACH TECH CO LTD
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