Vertical chip capacitor and manufacturing process thereof

Abstract

The invention discloses a vertical chip capacitor and a manufacturing process thereof, and belongs to the technical field of microelectronics. The capacitor comprises a capacitor substrate, the capacitor substrate comprises an upper end face and a lower end face, inner electrodes are arranged on the inner side of the upper end face and the lower end face, the inner electrodes comprise upper electrodes and lower electrodes, the upper electrodes and the lower electrodes are vertically arranged in a scattered mode, one ends of the upper electrodes are connected with the upper end face, the otherends of the upper electrodes are not in contact with the lower end face, the lower electrodes are connected with the lower end face, and the other ends of the lower electrodes are not in contact withthe upper end face; metal layers are arranged on the outer sides of the upper end face and the lower end face to form external terminal electrodes, and the terminal electrodes are parallel to an installation surface and are connected with the inner electrodes. According to the capacitor, an inner structure of the capacitor is improved to solve the capacitor application problem in a thinned and small-sized sealing member, and the capacitor is vertically arranged, so that sacrifice does not needed on a framework to ensure completeness of the framework, and meanwhile the purposes of changing capacitor shape and electrode direction are achieved by changing a printing technology, a cutting method and a coating technology of the electrodes.

Description

technical field [0001] The invention relates to a vertical patch capacitor and a manufacturing process thereof, belonging to the technical field of microelectronics. Background technique [0002] Capacitor is a mature microelectronic passive device, which is mostly used for energy storage or filtering on circuits. However, when the existing MLCC capacitor is used in a flat package component, its shape and terminal electrode form are not suitable for vertical components in the package. The installation method causes troubles to the application of the capacitance in the packaged components. [0003] The troubles caused by MLCC capacitors to installation: the automatic installation of devices in package components is carried out by automatic welding process, which is suitable for flat objects with large surface area, while the shape of conventional MLCC capacitors is as follows: Figure 6 As shown, it has a narrow and flat shape, and the upper surface is narrow and slender, and...

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Problems solved by technology

[0002] Capacitor is a mature microelectronic passive device, which is mostly used for energy storage or filtering on circuits. However, when the existing MLCC capacitor is used in a flat package component, its shape and terminal electrode form are not suitable for vertical components in the package. The installation method causes troubles to the application of the capacitor in the package

[0003] The troubles caused by MLCC capacitors to installation: the automatic installation of devices in package components is carried out by automatic welding process, which is suitable for flat objects with large surface area, while the shape of conventional MLCC capacitors is as follows: Image 6 As shown, it has a narrow and flat shape, and the upper surface is narrow and slender, and the surface is uneven due to the bulging of the electrodes 7 at both ends, resulting in an extremely low capture rate of the automatic welding process (chip loading process), resulting in a good product in automatic production The rate is not high, and if manual film loading is used, the efficiency and accuracy of film loading will be worrying; Figure 6-7 As shown, the terminal electrodes 7 of the MLCC capacitor 14 are located at both ends of the horizontal direction. If it is installed in a package component, in order to form a circuit, it is necessary to open a gap on the frame to accommodate the MLCC capacitor 14 or increase the number of frames, thus sacrificing the frame The integrity of the product reduces the heat dissipation of the product and the bonding force between the frame and the outer plastic packaging material

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