Unlock instant, AI-driven research and patent intelligence for your innovation.

A composite thermistor chip and its preparation method

A thermistor chip and heat-sensitive technology, which is applied in thermistor, manufacturing resistor chip, resistance manufacturing, etc., can solve the problem of inability to change, difficulty in meeting use needs and special production requirements, inability to bring functions and applications, etc. problem, to achieve the effect of simple steps, easy implementation, and small temperature coefficient

Active Publication Date: 2020-01-21
ZHAOQING EXSENSE ELECTRONICS TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The temperature characteristic curve of a conventional thermistor chip is basically determined by the formula of the thermosensitive ceramic material used, which cannot be changed, and it is difficult to meet different use needs and special production requirements, and cannot bring new functions and applications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A composite thermistor chip and its preparation method
  • A composite thermistor chip and its preparation method
  • A composite thermistor chip and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] see image 3 , which is a schematic structural diagram of the composite thermistor chip of this embodiment.

[0036] The composite thermistor chip of this embodiment includes a thermal ceramic chip 1 , a metal electrode 2 and a glass glaze resistor 3 .

[0037] The heat-sensitive tile 1 is a rectangular tile, the two surfaces of which are the front and the back respectively, and the thickness is 200-2000 μm.

[0038] The metal electrode 2 includes a first terminal electrode 21 , a second terminal electrode 22 and a third electrode layer 23 . The first terminal electrode 21 and the second terminal electrode 22 are respectively arranged on two ends of the front surface of the heat-sensitive ceramic chip 1 , and the third electrode layer 23 covers the back surface of the heat-sensitive ceramic chip 1 .

[0039] The glass glaze resistor 3 is arranged on the front surface of the heat-sensitive ceramic chip 1 , and its two ends are respectively connected to the first termin...

Embodiment 2

[0043] see Figure 5 , which is a schematic structural diagram of the composite thermistor chip of this embodiment.

[0044] The composite thermistor chip of this embodiment includes a thermal ceramic chip 1 , a metal electrode 2 and a glass glaze resistor 3 .

[0045] The heat-sensitive tile 1 is a rectangular tile, the two surfaces of which are the front and the back respectively, and the thickness is 200-2000 μm.

[0046] The metal electrode 2 includes a first terminal electrode 21 and a second terminal electrode 22 . The first terminal electrodes 21 and the second terminal electrodes 22 are respectively arranged at two ends of the back surface of the heat-sensitive tile 1 .

[0047] The glass glaze resistor 3 is arranged on the front surface of the heat-sensitive ceramic chip 1 . The resistance value of the glass glaze resistor 3 is 10kΩ.

[0048] Specifically, the material of the heat-sensitive tile 1 is an NTC heat-sensitive ceramic material with a material constant ...

Embodiment 3

[0051] see Figure 7 , which is a schematic process flow diagram of the preparation method of Example 3.

[0052] This embodiment provides the preparation method of the composite thermistor chip of embodiment 1 and embodiment 3, and the specific steps are as follows:

[0053] (1) After mixing the raw materials according to the conventional NTC heat-sensitive ceramic material formula, ball milling, drying, sieving, pre-calcination, grinding, drying, and sieving are carried out in sequence to obtain the prepared NTC heat-sensitive ceramic powder 4 for later use.

[0054] (2) Place the prepared NTC heat-sensitive ceramic powder 4 in a rubber mold to loosen and vibrate, then place the rubber mold in an isostatic press to press, the pressing pressure is 200-400MPa, and the pressing time is 10-50 Seconds, after releasing the pressure, take out the ceramic ingot 5 formed into a rectangular parallelepiped structure from the rubber mold, then sinter the ceramic ingot 5 at a high tempe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a composite thermistor chip, the composite thermistor chip includes a heat-sensitive porcelain chip, a metal electrode and a glass glaze resistor, the heat-sensitive ceramic chip is provided with a front side and a back side, and the metal electrode includes a first Terminal electrodes and second terminal electrodes, the first terminal electrodes and the second terminal electrodes are respectively arranged on the two ends of the front or back of the heat-sensitive porcelain, and the glass glaze resistor is arranged on the heat-sensitive porcelain on the front or back of the sheet. The present invention also relates to the preparation method of the composite thermistor chip: NTC thermosensitive ceramic powder is pressed and molded, then sintered at high temperature into a ceramic ingot, and then the ceramic ingot is cut into a ceramic thermosensitive substrate, and then printed on the ceramic thermosensitive substrate The metal electrode layer and the glass glaze resistance, and then sintering the ceramic thermosensitive substrate at high temperature, and cutting it after sintering to obtain a single composite thermistor chip. The composite thermistor chip of the invention has the advantages of adjustable temperature curve, simple structure, simple preparation and low cost.

Description

technical field [0001] The invention belongs to the technical field of electronic components, in particular to a composite thermistor chip and a preparation method thereof. Background technique [0002] With the innovation of electronic products, more and more electronic products have added temperature sensing or detection functions, and the core component of temperature detection is the thermistor chip, which itself has a resistance value that changes with temperature. Therefore, the temperature at the location of the thermistor chip can be determined according to the resistance value of the thermistor chip, so as to achieve the purpose of temperature sensing or detection. [0003] see figure 1 , which is a schematic structural view of a conventional thermistor chip. The conventional thermistor chip includes a thermal ceramic chip 1' and metal electrodes 2' printed on both surfaces of the thermal ceramic chip 1'. Such as figure 2 As shown, the manufacturing method of th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04H01C1/14H01C1/142H01C17/00H01C17/065H01C17/28H01C17/30
CPCH01C1/1413H01C1/142H01C7/041H01C7/042H01C17/006H01C17/065H01C17/281H01C17/30G01K7/22H01C1/034H01C7/008
Inventor 段兆祥叶建开杨俊柏琪星唐黎民
Owner ZHAOQING EXSENSE ELECTRONICS TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com