Roll-type FPC circuit diagram making device and method

Abstract

The invention provides a roll-type FPC circuit diagram making device and method. UV light solidification ink is used for replacing a conventional dry film and other light sensing resists, and UV lightsolidification of an FPC after ink printing is carried out, thereby enabling the UV light solidification ink to be directly hardened to form a film without waiting. The roll-type device can completethe operations in an integrated manner without cutting an FPC, is short in production period, is simple in flow, and is mall in occupied area. Meanwhile, a transmission mechanism employs a first transmission mechanism and a second transmission mechanism, which are of different structures. The first transmission mechanism is a crawler-type transmission mechanism, and the central area of the FPC ishollowed out in a transmission process, thereby avoiding the adhesion loss after the printing of ink. The second transmission mechanism employs a DES transmission mechanism which is suitable for a spraying-type wetting process, thereby facilitating the subsequent etching and demoulding operation. The device is reasonable in structure design.

Description

technical field [0001] The invention relates to the field of FPC, in particular to a roll-type FPC circuit pattern production equipment and method which have high production efficiency and low cost and can perform circuit production on FPC coils. Background technique [0002] FPC (Flexible Printed Circuit, flexible circuit board), also known as soft board, is a highly reliable and flexible printed circuit board made of polyimide or polyester film as the base material. , an indispensable and important connector for automotive consumption and electronic products. [0003] The FPC circuit production method often adopts the printed circuit board halving photosensitive pattern production process method, that is, laying a photosensitive resist such as a dry film on the surface of the FPC, then exposing the dry film and developing it into an image, and then etching it out. Lines, and finally the process of stripping the resist. The specific steps are: 1. Paste dry film and other ...

AI Technical Summary

Problems solved by technology

Among the above process steps, steps 1 to 3 need to be completed under the condition of yellow light, which has the following disadvantages: 1) The production cycle is long, the process is cumbersome, and the efficiency is low; 2) Employees operate in the yellow light source for a long time, and it is easy to be unsuitable ; 3) The film thickness of the dry film waiting for the line protection film to be transferred is thick, and the side etching rate is high; 4) A large number of fully automatic equipment is expensive and the cost of auxiliary materials is high. Auxiliary materials such as dry film and developer are required, and the cost is high

Furthermore, due to the limitation of the existing FPC circuit manufacturing method, that is, it needs to stand for a long time after the dry film is applied and after exposure, so the existing method has the processing of the FPC sheet, or uses a large number of expensive Equipment and automation equipment connect individual processes in series to realize the Roll To Roll process, which makes the processing steps cumbersome, long production cycle, expensive equipment, and large site occupation

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