Hand-held plasma polishing device

Abstract

The invention discloses a hand-held plasma polishing device. The hand-held plasma polishing device comprises a guide pipe, the inside of the guide pipe is in a hollow structure to form a liquid cavity, the front end of the guide pipe is provided with a spray nozzle, and the tail end of the guide pipe is provided with a movably openable locking mechanism and connected with an air pipe; the guide pipe is a conductor and connected inside a circuit and provided with a handle. The hand-held plasma polishing device has the advantages of being convenient to handhold and capable of polishing workpieces to be polished on a production line during production, and by holding the handle by hands to adjust the spaying direction, achieving the aim of polishing large workpieces to be polished without damage on other parts not to be polished, thereby overcoming the defects in the prior art and having a good popularization prospect.

Description

technical field [0001] The invention relates to the technical field of plasma polishing, in particular to a hand-held plasma polishing device. Background technique [0002] Plasma polishing technology is to immerse a positively charged metal polishing piece in a negatively charged polishing solution and apply high voltage. At this time, the polishing solution near the surface of the polishing piece evaporates and is subjected to the action of voltage to generate a plasma gas layer. In this plasma A high-voltage discharge channel appears in the gas layer, and the high-voltage discharge channel accelerates electrons to bombard the surface of the polished piece and slightly melts the surface of the polished piece. Since the surface of the polished piece is an equipotential surface in the electric field, it is easier to form a discharge channel on the uneven surface of the polished piece. The slightly melted part on the surface of the polished part will automatically become a fl...

AI Technical Summary

Problems solved by technology

[0003] The existing plasma polishing methods are all operated in special instruments, that is, the polished parts are polished in a special plasma polishing machine after processing, so they cannot be directly applied to the production line, and at the same time, they cannot be used for larger and longer polished parts. Polishing, because the polishing piece is immersed in the polishing liquid as a whole, it is difficult to polish specific parts of the polishing piece, and it is easy to damage the protruding parts such as edges and corners of the polishing piece. The present invention aims to solve the above problems and realize miniaturized plasma polishing In this way, the polished parts in the production process can be polished on the production line, the polished parts of any shape can be polished, and the specified position of the polished part can be polished without destroying the surface shape of other positions of the polished part

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